Abstract: An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.

Abstract: An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.

Abstract: A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

Abstract: A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.

Abstract: A package structure of an integrated circuit is used for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, a plurality of wires, two molded resins. The substrate has a lower surface formed with signal input terminals and signal output terminals, which are to be connected to the signal input terminals. The signal output terminals are electrically connected to the printed circuit board. The integrated circuit has a lower surface for mounting the integrated circuit to the upper surface of the substrate. The two sides on the lower surface of the integrated circuit formed with a plurality of bonding pads. While the integrated circuit mounted to the substrate, the bonding pads are exposed to the outside. The plurality of wires are electrically connected the bonding pads to the substrate. Thus, the signals from the integrated circuit can be transmitted to the substrate.

Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: The present invention discloses a via plug formed in a zig-zag bordered opening in a semiconductor structure wherein the film stress in a barrier/glue layer TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling of the TiN layer from the contact opening occurs. The via plug can be formed in a process by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.

Abstract: The present invention discloses an integrated ethanol gas sensor and fabrication thereof. The present invention utilities micro electro mechanical system (MEMS) technology and has a main sensing part in the form of a cantilever-bridge structure made of SiC thin film material arranged over a silicon substrate. The present invention integrates an SiC heater of comb or finger electrode shape and an SnO.sub.2 thin film gas sensing element applied over distinct portions on the same Si substrate together with Al2O3 and SnO2 thin films via a VLSI technology.

Abstract: The present invention discloses a method for forming a zig-zag bordered opening in a semiconductor structure such that the film stress in a barrier/glue layer of TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling-off of the TiN layer from the contact opening occurs. The method can be easily carried out by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.

Abstract: The present invention provides protection from lasers with a high nonlinear bsorption structure including a mirror which directs an incident beam to a beam splitter. A focusing lens receives and focuses the radiation to a higher intensity beam which is directed into an absorption material with a third order polarization property. Such materials will cause a two-photon absorption partial attenuation from the intensified beam when the incident radiation intensity is greater than ambient intensity. A focusing mirror receives the partially attenuated beam and reflects and refocuses the partially attenuated beam back through the absorption material, which now acts as a single photon absorption material to further attenuate the beam. The doubly attenuated beam passes through the focusing lens which recollimates the doubly attenuated beam and directs it to the beam splitter which in turn directs the beam to the receiving device.

Abstract: A swiveling electric fan comprising a truncated sphere-shaped housing which encloses a vane member, and a base having a concave spheric top surface with the same diameter as that of the housing, the housing being connected with the base in a swiveling manner, an upper end of the supporting disk being secured to the housing while a lower end thereof extending into the base to connect with and abut against a rotary guiding disk of a swiveling mechanism in a swiveling manner, so that when the guiding disk rotates, a sleeve section of the supporting disk is rotated in a circular hole of the top surface of the base, the circular hole being larger than the sleeve section in diameter, whereby the vane member is made to swivel through an elliptical trace.

Abstract: An eye protection device for protection against a broad spectrum of incid high intensity radiation includes a beam splitter which transmits the radiation to a first focusing lens which in turn focuses the radiation on a first mirror. The first mirror has a sacrificial surface which desorbs if the radiation has a predetermined minimum intensity. A second lens receives radiation reflected from the first mirror and directs the beam orthogonally onto a second mirror. The beam reflects off the second mirror and is directed back through the second lens which refocuses the beam onto the surface of the first mirror at the original area. When the initial beam was above the minimum, reflectivity at this location will have been destroyed and the beam will pass harmlessly through the mirror. If the initial beam does not destroy the surface, the beam will be reflected back to the beam splitter and then to a receiving device.

Abstract: A warm mist humidifier wherein the steam-heating means thereof is composed of an outer heating means and an inner heating means having a plurality of oblique blades mounted around its upper periphery. A thin layer of water flowing from a reservoir between said outer heating means and inner heating means is rapidly heated into steam when disposed beneath the steam-heating means a heater is actuated, the ascending steam thrust on the blades to rotate the inner heating means to rub the outer heating means continuously, preventing minerals or other deposits from depositing thereon and permitting the deposits to be carried by hot water to a collector disposed around the outer heating means and there after to a filter means through a groove for filtering, thereby eliminating the disadvantage of usually manual cleaning of the humidifier.