Abstract: Techniques for high speed optoelectronic coupling by redirection of optical path are disclosed. In one particular embodiment, the techniques may be realized as an optoelectronic receiver comprising an optical signal demultiplexer that may be configured to transmit an optical signal along a first axis, and a photodiode that may be configured to convert the optical signal into an electrical signal, wherein the optical signal demultiplexer may include an inclined end surface that may be configured to reflect the optical signal towards a photoactive area of the photodiode at an obtuse angle of reflection with respect to the first axis.

Abstract: A method for forming optical devices on-planar substrates, as well as optical devices formed by the method are described. The method uses a linear injection APCVD process to form optical waveguide devices on planar substrates. The method is performed at approximately atmospheric pressure. According to the method, a wafer with a lower cladding layer already formed by either CVD or oxidation is placed on a conveyer, which may include a heating element. The heated wafer is transported underneath a linear injector such that the chemicals from the linear injector react on the wafer surface to form a core layer. After the core layer is formed, photoresist is spun on the surface of the wafer, and then standard lithography is used to pattern the optical devices. Next, reactive ion etching (RIE) is used to form waveguide lines. The remaining photoresist is then removed. An upper cladding layer is formed to substantially cover the core regions.

Abstract: A filter module that includes a filter, such as an AWG filter, and a semiconductor optical amplifier (SOA) is described. Additionally, a method of multiplexing and/or demultiplexing optical signals using the DWDM filter module is described. The filter and SOA can be integrated together either through compact packaging (with fiber and connectors), or through on-chip integration. The SOA can fully compensate for the insertion loss due to, for example, an AWG filter or plurality of AWG filters. Additionally, the polarization dependent loss of the composite module can be reduced by adjusting the polarization dependent gain of the SOA to compensate for the polarization dependent loss of the AWG filter.

Abstract: A method for forming optical devices on-planar substrates, as well as optical devices formed by the method are described. The method uses a linear injection APCVD process to form optical waveguide devices on planar substrates. The method is performed at approximately atmospheric pressure. According to the method, a wafer with a lower cladding layer already formed by either CVD or oxidation is placed on a conveyer, which may include a heating element. The heated wafer is transported underneath a linear injector such that the chemicals from the linear injector react on the wafer surface to form a core layer. After the core layer is formed, photoresist is spun on the surface of the wafer, and then standard lithography is used to pattern the optical devices. Next, reactive ion etching (RIE) is used to form waveguide lines. The remaining photoresist is then removed. An upper cladding layer is formed to substantially cover the core regions.

Abstract: A method for forming optical devices on planar substrates, as well as optical devices formed by the method are described. The method uses a linear injection APCVD process to form optical waveguide devices on planar substrates. The method is performed at approximately atmospheric pressure. According to the method, a wafer with a lower cladding layer already formed by either CVD or oxidation is placed on a conveyer, which may include a heating element. The heated wafer is transported underneath a linear injector such that the chemicals from the linear injector react on the wafer surface to form a core layer. After the core layer is formed, photoresist is spun on the surface of the wafer, and then standard lithography is used to pattern the optical devices. Next, reactive ion etching (RIE) is used to form waveguide lines. The remaining photoresist is then removed. An upper cladding layer is formed to substantially cover the core regions.

Abstract: A method and apparatus are disclosed whereby integrated optical circuits having waveguide ends of lens geometry are formed which improve the waveguide's optical coupling to light sources and detectors. A channel waveguide is formed on a substrate and the waveguide ends are shaped into lens form by etching to form a protrusion and heating the waveguide to or above the softening temperature of core material of the waveguide resulting in surface tension in the core material that functions to shape the protrusion into a substantially cone-shaped lens end having a smooth surface.

Abstract: An optical waveguide forming process is disclosed which enables glass waveguides to be deposited on metalized substrates without substantial degradation of the wiring of the substrate. The process involves the use of carbon material to protect the metal wiring on or embedded in the substrate during the consolidation phase of the waveguide formation. The carbon plate reacts readily with oxygen impurities to control the oxygen partial Pressure during the consolidation phase.