Abstract: A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material and adapted to couple with a solder ball having a second conductive material, the first conductive material having a higher reflow temperature than the second conductive material.

Abstract: Apparatus and methods providing for interconnecting a component to a substrate comprising one or more via-in-pad (VIP) interconnects is presented. In one embodiment in accordance with the invention, a first interconnect material is deposited on the VIP bond pad and into at least a portion of the VIP bore adjacent the bond pad. The substrate is subjected to a reflow process to form a plug of first reflowable interconnect material having a cap and a stem. The cap conforms to the bond pad and has a predetermined thickness and a diameter larger than the diameter of the bore. The stem conforms to the diameter of the bore and extends from the cap into the bore a predetermined distance. A component interconnect is coupled to the VIP bond pad and the cap using a second reflowable interconnect material having a reflow temperature lower than that of the first interconnect material. The plug remains in a solid form and effectively blocks the migration of the second reflowable interconnect material into the VIP bore.