Abstract: A semiconductor cleaning tool is provided. The cleaning tool comprises a nozzle. The nozzle is connected with a first inlet to receive a carrier gas and a second inlet to receive one or more fluids. The nozzle comprises a gas passageway connected to the first inlet; and fluid passageway connected to the second inlet. The gas passageway comprises gas passage branches and the fluid passageway comprises fluid passage branches. The gas passage branches and the fluid passage branches are arranged interweavingly in the nozzle. Individual gas/fluid passage branches are controllable indecently and separately including a flow rate, a temperature, an on/off state, a type of fluid(s) or carrier gas, a time period, a supply mode, and/or any other aspects of spraying the fluid(s) and carrier gas through the individual gas passage branches and the individual fluid passage branches.

Abstract: Embodiments of the present invention pertain to determining the reliability of a disk drive. According to one embodiment, values for a parameter associated with a particular type of component of the disk drive are detected while simulating customer usage of the disk drive. The values are stored to enable analyzing the values for statistical variations to determine the reliability of the disk drive.

Abstract: Embodiments of the present invention pertain to determining the reliability of a disk drive. According to one embodiment, values for a parameter associated with a particular type of component of the disk drive are detected while simulating customer usage of the disk drive. The values are stored to enable analyzing the values for statistical variations to determine the reliability of the disk drive.

Abstract: A hinge in accordance with the present invention comprises a first element and a second element pivoted together to reciprocally rotate from an open position to a closed position. The first element includes a hollow central body, a hinge pin and a fastening pin being transversely mounted in the hollow central body. The second element includes a strip extended therefrom. The strip includes an opening in a middle thereof. A distal portion of the strip is extended into the hollow central body and wound around the hinge pin so as to form a stop that is associated with the opening. A spring is mounted around the fastening pin. The spring includes a first end attached to a bottom of the hollow central body and a second end that is extended through the opening and attached to the stop of the strip, thereby providing control between the first element and the second element by elasticity of the spring.

Abstract: A hinge mainly comprises a fixing plate, a base plate, a connection, and a door related hinge part. The fixing plate is provided with fixing holes for securing to the jamb of cabinet and a side plate having a auxiliary fixing hole. The base plate is mounted to the fixing plate and has two bumps and notches. The connection comprises a pin hooked by the notch of the base platen and a buckle being urged by a spring element to clasp the edge of the bump. The door related hinge part is mounted to the connection.

Abstract: A method for determining an end point in a chemical mechanical polishing process by utilizing a dual wavelength interference technique and an apparatus for carrying out such method are provided. In the method, a rotating platen that is equipped with a laser generating source capable of generating laser emissions in two different wavelengths is utilized such that a dual wavelength interference pattern may be received by a laser detector and a greatly expanded period between cycles in a resulting dual wavelength interference pattern may be utilized to determine the end point for material removal in a significantly larger thickness of material. The present invention novel method and apparatus can be utilized not only in monitoring the end point of CMP polishing of a thin oxide layer such as ILD or STI, but also in material removal of larger thickness such as in the planarization process of an IMD layer.

Abstract: A hinge structure includes a casing having a depression and a space for receiving a spring member and a base. The base is rotatably secured in the space and includes two cams. A hinge member includes an extension secured to the base and rotated in concert with the base. A spring includes two ends for resiliently engaging with the cams so as to position the cams and the hinge member in suitable angular position. The hinge structure includes a simplified configuration excellent for manufacturing and assembling purposes.