Abstract: A method for interconnecting components of an electronic system includes depositing a sintering solution onto a first component to form an interconnection layer, the sintering solution having metal nanoparticles dispersed in a solvent, and a stabilizing agent adsorbed onto the nanoparticles. The nanoparticles have for more than 95.0% of their mass a metal selected from silver, gold, copper and alloys thereof and have a polyhedral shape with an aspect ratio of more than 0.8. The method also includes eliminating, at least partially, solvent from the layer to form an agglomerate in which the stabilizing agent binds nanoparticles together and maintains at least a portion of the nanoparticles at a distance from each other; debinding and sintering the layer by bringing the agglomerate into contact with a destabilizing agent to aggregate and coalesce the nanoparticles and depositing a second component in contact with the layer before or during debinding or sintering.

Abstract: A method for interconnecting components of an electronic system includes depositing a sintering solution onto a first component to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the nanoparticles. More than 95.0%, preferably more than 99.0% of the mass of the nanoparticles include a metal selected from silver, gold, copper and alloys thereof and have a polyhedral shape with an aspect ratio greater than 0.8. The method also includes eliminating, at least partially, the solvent from the layer to form an ordered agglomerate in which the nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the nanoparticles at a distance from each other, debinding and sintering the layer, and depositing a second component in contact with the layer before or during debinding or sintering.

Abstract: Method for interconnecting components of an electronic system, the method comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles. the metal nanoparticles comprising for more than 95.0%, preferably for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.

Abstract: Method for interconnecting components of an electronic system comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles, more than 95.0%, preferably more than 99.0% of the mass of the metal nanoparticles comprising a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.