Abstract: A card guide which optimizes the flow of forced cooling air, provides for self alignment to a host motherboard and provides for integrated ESD hazard mitigation, includes an elongated body having a groove disposed along a longitudinal axis of the body. The groove is adapted for receiving the edge of an inserted daughter card. The card guide further includes integral, arcuate inner and outer deflectors, which form a channel for redirecting incident air flow toward regions of the daughter card which would otherwise be blocked from the air flow. The end of the card guide that receives the daughter card houses an ESD clip. The ESD clip functions to dissipate static charge accumulated on the daughter card from a conductive strip disposed along the edge of the daughter card. The ESD clip further serves to dissipate accumulated static charge from a front panel attached to the daughter card, via a guide pin fixedly attached to the front panel.

Abstract: A card guide which optimizes the flow of forced cooling air, provides for self alignment to a host motherboard and provides for integrated electro-static discharge (ESD) hazard mitigation. includes an elongated body having a groove disposed along a longitudinal axis of the body. The groove is adapted for receiving the edge of an inserted daughter card. The card guide further includes integral, arcuate inner and outer deflectors, which form a channel for redirecting incident air flow toward regions of the daughter card which would otherwise be blocked from the air flow. Extension deflector assemblies may be situated between card guides to extend the inner and outer deflectors so as to minimize air flow discontinuities in regions between daughter card positions. The end of the card guide that receives the daughter card houses an ESD clip. The ESD clip functions to dissipate static charge accumulated on the daughter card from a conductive strip disposed along the edge of the daughter card.

Abstract: A modular card cage allows for improved access to the rear panel of a backplane, while providing for enhanced EMI shielding. First and second side panels, in combination with top and bottom covers, form the card cage. The top and bottom covers are adapted for removably mounting to the side panels, and, when mounted, provide lateral rigidity to the card cage. At least one of the top and bottom covers comprises a front portion and a rear portion. The front portion of the cover is preferably separable from the rear portion such that one of the front and rear portions is removable from the side panels, while the other of the front and rear portions remains mounted for providing lateral rigidity. EMI shielding is provided in all portions of the cage, including the removably mounted covers, preferably by means of embedded, continuous gasketing.

Abstract: In a method and apparatus for partitioning and packaging a power generation and distribution system, a plurality of power supply modules are distributed along the length of the backplane such that backplane voltage drops are minimized and such that power supply currents flow essentially orthogonal to the signal connections between the backplane slots. In this manner, signal interference is minimized and the need for bus bars on the backplane are substantially reduced or eliminated.

Abstract: In an improved connector assembly, a male pin (112) is inserted into a proximal end of a female contact which (110) conductivity engages the pin at a distal end, providing a folded signal path geometry. As a signal propagates in a first direction alone the male pin (112), it generates a first magnetic field of a first orientation about the male pin (112). At the contact point, the signal reverses direction and generates a second magnetic field of a second orientation opposite the first orientation about the female contact (110). Their respective opposed orientations cause the magnetic fields to substantially cancel in the region of magnetic interaction. Any remaining electronic fields are contained by grounded shielding in the female contact (110) cavities, for example in the form of chambers with conductivity coated walls surrounding the contacts. This configuration mitigates the effect of crosstalk between adjacent signals in the connector, and reduces the effective path length of the signal.

Abstract: A current regulating, transconductance amplifier is connected to the load capacitor of a backplane system. The load capacitor is connected close to the load inside the feedback loop of the regulating amplifier. The frequency response shaping networks of the amplifier are designed to include the pole and zero, contributed by this capacitor, to meet the criteria for fast settling of a current step at the load.

Abstract: A novel electrical interconnection system is described. The system includes a novel multiple-bussed matrix board and associated hardware and assembly tools for use therewith. The matrix board includes a plurality of plated-through holes arranged in a coordinate system of rows spaced 0.100 inches on center, measured from aperture-to-aperture. Selected apertures are electrically connected to selected bus bars on one or the other side of the board.

Abstract: A novel electrical interconnection system is described. The system includes a novel multiple-bussed matrix board and associated hardware and assembly tools for use therewith. The matrix board includes a plurality of plated-through holes arranged in a coordinate system of rows spaced 0.100 inches on center, measured from aperture-to-aperture. Selected apertures are electrically connected to selected bus bars on one or the other side of the board.

Abstract: A novel electrical interconnection system is described. The system includes a novel multiple-bussed matrix board and associated hardward and assembly tools for use therewith. The matrix board includes a plurality of plated-through holes arranged in a coordinate system of rows spaced 0.100 inches on center, measured from aperture-to-aperture. Selected apertures are electrically connected to selected bus bars on one or the other side of the board.