Patents by Inventor c/o Samsung Electro-Mechanics Co., Ltd.

c/o Samsung Electro-Mechanics Co., Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130170100
    Abstract: Disclosed herein are an electrode including a plurality of electrode active material layers formed above an electrode current collector, each of the electrode active material layers including different structures of binders; a method for manufacturing the same; and an electrochemical capacitor. According to the present invention, physical bonding strength of the electrode can be significantly improved, and thus, long-term reliability of the electrochemical capacitor can be improved, by developing an electrode in which the binder composition of a bonding portion of an electrode and an electrode current collector and the binder composition between the electrode active material layers are differentiated from one another, in order to develop low-resistance EDLC products.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 4, 2013
    Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: c/o Samsung Electro-Mechanics Co., Ltd.
  • Publication number: 20130162385
    Abstract: The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside. According to the present invention, it is possible to prevent process defects generated during a manufacturing process of an existing coil part using a ferrite substrate, improve process efficiency and productivity, and reduce manufacturing costs.
    Type: Application
    Filed: December 6, 2012
    Publication date: June 27, 2013
    Applicant: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: c/o Samsung Electro-Mechanics Co., LTD.
  • Publication number: 20130162382
    Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 27, 2013
    Applicant: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD
  • Publication number: 20130147595
    Abstract: Disclosed herein are coil parts including: a lower magnetic substance; a primary coil pattern disposed on the lower magnetic substance; a first complex layer for covering the primary coil pattern; a secondary coil pattern correspondingly disposed on an upper side of the primary coil pattern; a second complex layer for covering the secondary coil pattern; and an insulation layer disposed between the primary coil pattern and the secondary coil pattern and blocking an electrical connection between the primary coil pattern and the secondary coil pattern. The coil parts according to the present invention can have a simple structure and processing capable of increasing magnetic permeability and accordingly improving an impedance characteristic of the coil parts, thereby implementing excellent performance and characteristic.
    Type: Application
    Filed: December 12, 2012
    Publication date: June 13, 2013
    Applicant: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD
  • Publication number: 20130143030
    Abstract: Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced.
    Type: Application
    Filed: December 3, 2012
    Publication date: June 6, 2013
    Applicant: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: c/o Samsung Electro-Mechanics Co., Ltd.