Patents by Inventor C. Osterhout

C. Osterhout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically sealed packages and their method of manufacture
    Publication number: 20060038189
    Abstract: A device includes a temperature-sensitive material disposed between a first substrate and a second substrate. A metal-containing seal is disposed perimetrically between the first and second substrates. In addition, a method of forming a device includes providing a temperature-sensitive material between a first substrate and a second substrate. The method also includes applying an electromagnetic field, which inductively heats a metal-containing material that is disposed between the first and second substrates without heating the temperature sensitive material to a temperature greater than a threshold temperature.
    Type: Application
    Filed: August 18, 2004
    Publication date: February 23, 2006
    Inventors: Calvin Coffey, Dominick Forenz, Noshir Havewala, David Lineman, C. Osterhout