Abstract: A method and associated computer system and computer program product. An image is obtained of a product recommender who is interacting with a product. The product recommender is identified based on the image. Information on the product is provided based on the identified product recommender.

Abstract: A self-heating, self-hydrating pouch to simultaneously heat and hydrate a prepackaged, partially or completely dehydrated food or beverage product that is stored in the pouch. The pouch comprises multiple layers of material that prevent the transmission of water and gasses thereby preventing deterioration of the prepackaged food or beverage product. The pouch includes a membrane filter structure and flameless, exothermic reaction agents. The user adds potable or non-potable water to the pouch. When the water contacts the exothermic reaction agents, an exothermic reaction occurs which heats the water above 200° F. The membrane filter structure filters the heated water to remove bacteria, viruses, chemicals and by-products of the exothermic reaction. The filtered, heated water contacts the partially or completely dehydrated food product or dehydrated beverage product and simultaneously heats and hydrates the food or beverage product.

Abstract: A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.

Abstract: A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.

Abstract: A method for manufacturing a chip size package comprises the steps of: providing a chip having a plurality of bonding pads on its active surface; providing a metal board consisting of the upper layer and the lower layer, wherein, a chip carrier, corresponding to said least chip, being formed on the surface of the upper layer of the said metal board; selectively etching the upper layer of the metal board to form a plurality of redistribution conductive circuits supported by the lower layer of the metal board; securing the chip to the chip carrier of the upper layer of the metal board, and electrically connecting to the conductive circuits; providing a package body (or underfill) in between the chip and the upper layer of the metal board; and, removing the lower layer of the metal board. Thus, package manufactured by applying present invention has ability of securing more electrodes and thinner thickness.