Abstract: A phenolic novolac cured epoxy resin system, preferably utilized in electrical laminating applications, producing resins with a favorable balance of properties including relatively low Dk values with comparable Tg and time to delaminate values. The phenolic novolac curing agent is substituted with alkyl or aryl groups, which may be the same or different. The alkyl group is preferably a C2-C20 group, more preferably a C4-C9 group, and most preferably a butyl or octyl group. The aryl group is preferably a phenyl group. The curing agents of the invention and may be used separately, in combination with each other, or in combination with other curing agents.