Patents by Inventor C.T. CHUANG

C.T. CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • UBM structure for strengthening solder bumps
    Publication number: 20080251916
    Abstract: A novel UBM structure for improving the strength and performance of individual UBM layers in a UBM structure is disclosed. In one aspect, a UBM structure for disposal onto an electrically conductive element comprised of aluminum is disclosed. In one embodiment, the UBM structure comprises a tantalum layer disposed over the aluminum electrically conductive element, and a copper layer disposed over the tantalum layer, where the UBM structure is configured to receive a solder ball thereon.
    Type: Application
    Filed: April 12, 2007
    Publication date: October 16, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: CHIU SUNG CHENG, HSIU-MEI YU, CHIA-JEN CHENG, C.T. CHUANG, CHUN-YEN LO, LI-HSIN TSENG