Patents by Inventor C. W. Hsiao

C. W. Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming stacked-die packages
    Patent number: 8426256
    Abstract: A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: April 23, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: C. W. Hsiao, Bo-I Lee, Tsung-Ding Wang, Kai-Ming Ching, Chen-Shien Chen, Chien-Hsiun Lee, Clinton Chao
  • METHOD OF FORMING STACKED-DIE PACKAGES
    Publication number: 20100279463
    Abstract: A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer.
    Type: Application
    Filed: February 5, 2010
    Publication date: November 4, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: C. W. Hsiao, Bo-l Lee, Tsung-Ding Wang, Kai-Ming Ching, Chen-Shien Chen, Chien-Hsiun Lee, Clinton Chao