Abstract: An interposer for converting pitches includes an interconnect structure over the semiconductor substrate, an active circuit formed on the semiconductor substrate, wherein the active circuit is electrically connected to the interconnect structure, a first plurality of pads with a first pitch over the interconnect structure, a second plurality of pads underlying the semiconductor substrate, and a plurality of through-substrate vias in the semiconductor substrate, wherein the first and the second plurality of pads are interconnected through the plurality of through-substrate vias.

Abstract: There is provided a method of fabricating a coil and in particular to one including the steps of forming a frame with two vertically disposed supporting legs, mounting an axial coil and notches on the supporting legs, cutting off the conducting wire from two ends of the ferrite core of the coil, joining the conducting wire to the two ends of the ferrite core, enclosing the combined coil and the supporting legs with resin, and bending the lower part of the supporting leg upwardly along the outer surface of the coil.