Abstract: An improved packaged liquid crystal display (LCD) assembly is described. A recess is used to house a support material while the LCD cell 609 is positioned at least partially within the containment structure. A plurality of spaced apart stabilizers are attached from the sides of the LCD cell 609 to the substrate without transmitting residual stresses induced during fabrication and operation. A support material is dispensed in the recess such that it provides support for the LCD cell 609 without transmitting residual stresses from the substrate. The described arrangements permit an LCD assembly which minimizes the amount of forces and stresses that lead to optical defects. The stabilizers, in addition to supporting the cell, also act to contain the encapsulating material used to protect the bonding wires. The support material, in addition to minimizing transmission of stresses, also provides improved heat dissipation from the LCD cell 609.

Abstract: A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionally, solder bumps within the molding material are attached to input and output contact points on the semiconductor die. Portions of the solder bumps are exposed through the surface of the molding material so that contact can be made with the electrical contacts of an electronic device to be stacked upon the semiconductor package. The electronic device may be, for example, another semiconductor die or an opto-electronic transceiver. The present invention also includes a method for manufacturing the stacked molded package. The method involves forming the semiconductor package within a molding chamber which is injected with the protective molding material.

Abstract: A connection assembly (50) to electrically couple a transparent plate (24) of a liquid crystal display device (51) to an operating subsystem. The connection assembly (50) includes an elongated flexible tape member (52) having an elongated metallic circuit (53) which further includes a main circuit portion (55) fixedly mounted to the tape member (52), and a lead terminal (56). This terminal (56) includes a contact portion (57) adapted to electrically couple to the transparent plate (24), and a substantially flexible and movable conductive joint portion (58). The contact portion (57) and the conductive joint portion (58) electrically couple the transparent plate (24) to the circuit portion (55) of the metallic circuit (53) in a manner substantially minimizing residual stresses formed from the electrical coupling between the transparent plate (24) and the circuit portion (55).

Abstract: An improved PTC fuse assembly is described. The PTC fuse assembly includes a PTC fuse having a PTC material. To expedite heating of the PTC material, the improved PTC fuse assembly includes a die package in thermal communication with the PTC material. The die package includes a die which is responsible generating heat once a threshold has been reached. To mount the die package to a printed circuit board, the die package includes leads. The leads are sufficiently flexible such that the heat generated by the die does not compromise performance of the PTC protection circuit.

Abstract: A liquid crystal display package including a liquid crystal cell having a die with a pixel array, and a transparent plate attached to the die. A liquid crystal material is disposed in a gap region between the die and the transparent plate. The display assembly further includes a containment structure adapted to couple to and at least partially receive liquid crystal cell therein, and an electrical connector portion integrated with the containment structure. A plurality of conductive contacts are positioned in the containment structure for secured support thereof, and in substantially stress-free electrical connection with the pixel array. The conductive contacts further are configured to releasably couple to mating conductive contacts of an opposed electrical connector.

Abstract: A low cost device that provides a true die to external fiber optic connection. The device includes a semiconductor die having a first surface, an integrate circuit fabricated on the first surface of the semiconductor die and a package encapsulating the semiconductor die. The device also includes a module mounted onto the package and configured to receive an external fiber optic cable. An opto-electric device, housed in the module is optically coupled to the fiber optic cable when the cable is inserted into the module. To provide the direct die to external fiber optic connection, at least one electrical conductor is provided between the integrated circuit fabricated the semiconductor die, through the package and module, and directly to the opto-electrical device.