Abstract: A method of fabricating an optical lens disclosed herein includes forming a layer of a flat lens structure on a front surface of a substrate, depositing a protective metal layer on the layer of the flat lens structure and on a back surface of the substrate, wherein the protective layer includes chromium, gold, titanium, or nickel, wherein the back surface is located opposite to and away from the front surface having the layer of the flat lens structure, irradiating the protective metal layer at the front surface with a laser to form a channel (i) through the protective metal layer, (ii) through the layer of the flat lens structure and (iii) in the substrate, removing the protective metal layer at the front surface and the back surface of the substrate, and separating the layer of the flat lens structure from the substrate to obtain the optical lens, wherein the channel has a depth defined by a thickness of the substrate remaining at the channel after irradiating the protective metal layer at the front surface

Abstract: A metals-based additive manufacturing machine and method are disclosed. The machine and method include a hybrid temperature monitoring system. The hybrid temperature monitoring system includes a Raman spectrometer, a single-element ultrasound transducer, and a phased-array ultrasound pair. The hybrid temperature monitoring system can generate a real-time three-dimensional temperature map of the melt pool and optionally a portion of the metal powder base and/or a formed portion of a desired artifact. The real-time three-dimensional temperature map can be used for optimizing the metals-based additive manufacturing process in real-time or during subsequent process runs.

Abstract: The present invention discloses a multi-station adaptive walnut shell pre-breaking system, comprising a feeding device and a shell pre-breaking device.

Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.

Abstract: A method of fabricating an optical lens disclosed herein includes forming a layer of a flat lens structure on a front surface of a substrate, depositing a protective metal layer on the layer of the flat lens structure and on a back surface of the substrate, wherein the protective layer includes chromium, gold, titanium, or nickel, wherein the back surface is located opposite to and away from the front surface having the layer of the flat lens structure, irradiating the protective metal layer at the front surface with a laser to form a channel (i) through the protective metal layer, (ii) through the layer of the flat lens structure and (iii) in the substrate, removing the protective metal layer at the front surface and the back surface of the substrate, and separating the layer of the flat lens structure from the substrate to obtain the optical lens, wherein the channel has a depth defined by a thickness of the substrate remaining at the channel after irradiating the protective metal layer at the front surface

Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.

Abstract: A metals-based additive manufacturing machine and method are disclosed. The machine and method include a hybrid temperature monitoring system. The hybrid temperature monitoring system includes a Raman spectrometer, a single-element ultrasound transducer, and a phased-array ultrasound pair. The hybrid temperature monitoring system can generate a real-time three-dimensional temperature map of the melt pool and optionally a portion of the metal powder base and/or a formed portion of a desired artifact. The real-time three-dimensional temperature map can be used for optimizing the metals-based additive manufacturing process in real-time or during subsequent process runs.

Abstract: A multi-station adaptive walnut shell pre-breaking system, including a feeding device and a shell pre-breaking device. The feeding device includes a feeding box, a single-helix twister and a double-helix twister are disposed in the feeding box, the single-helix twister and the double-helix twister rotate in opposite directions, and an adjustable spring partition is disposed below the single-helix twister and the double-helix twister; the shell pre-breaking device includes a shell pre-breaking box, a plurality of squeezing stations are provided in the shell pre-breaking box, each of the squeezing stations is provided with a shell pre-breaking assembly, the shell pre-breaking assembly includes a falling U-shaped plate and a squeezing U-shaped plate.

Abstract: A method of forming a layered material including arranging a 2DLM on a base material comprising one or more Moiré interferences, and adding material or removing material at a location of the one or more Moiré interferences.

Abstract: A transmitter coil includes a winding part. The winding part is an elliptic-shaped spirally-wound coil with a hollow portion. The outer major axis length of the winding part is in the range between 78 mm and 82 mm. The outer minor axis length of the winding part is in the range between 44 mm and 48 mm. The inner major axis length of the winding part is in the range between 54 mm and 58 mm. The inner minor axis length of the winding part is in the range between 19 mm and 23 mm. The turn number of the winding part is in the range between 8 and 12. A transmitting module with the transmitter coil and a wireless charging device with the transmitter coil are also provided.

Abstract: A transmitter coil includes a winding part. The winding part is a circular-shaped spirally-wound coil with a hollow portion. The outer diameter of the winding part is in the range between 56 mm and 66 mm. The inner diameter of the winding part is in the range between 30 mm and 40 mm. The turn number of the winding part is in the range between 7 and 13. A transmitting module with the transmitter coil and a wireless charging device with the transmitter coil are also provided.

Abstract: The disclosure discloses an automated production system for efficient walnut shell-breaking, kernel-taking and shell-kernel separation, solving the problem that the existing walnut shell breaking device cannot adapt to walnuts having different sizes and shell breaking rate and shell breaking efficiency cannot be ensured. The system can realize efficient shell-breaking, kernel-taking and shell-kernel separation on different varieties of walnuts, is quick in production speed and high in automation degree, and meanwhile is capable of improving entire kernel rate and kernel obtaining rate, reducing the damage rate of the walnut kernel and ensuring the high shell-breaking efficiency and thoroughness of shell and kernel separation.

Abstract: Disclosed is a continuous feeding mechanism including a transfer mechanism, wherein the transfer mechanism includes a rotatable indent roller circumferentially provided with a plurality of blanking grooves; a post pin is arranged in each blanking groove; the post pin is connected with a spring; the spring is arranged towards the interior of the indent roller; and the post pin can move along the blanking grooves; a feeding box, wherein the bottom of the feeding box is hollow, and the bottom is arranged above the indent roller or the bottom is fixedly connected with the indent roller; the continuous feeding mechanism is arranged above one side of the transfer mechanism; and an electromagnetic heating mechanism which includes a supporting frame, wherein the transfer mechanism is arranged in the supporting frame, and an electromagnetic coil is circumferentially arranged outside the supporting frame.

Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.

Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.

Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.

Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.

Abstract: Memory systems may include a memory storage including at least a first stripe and a second stripe, the first stripe including data pages corresponding to the first stripe and a first parity page suitable for storing a first XOR parity, and the second stripe including data pages corresponding to the second stripe and a second parity page suitable for storing a second XOR parity, the data pages and parity pages being stored over a plurality of memory dies, wherein each memory die includes a number of planes; and a controller suitable for cyclically interleaving the data pages corresponding to the first stripe and the data pages corresponding to the second stripe.

Abstract: Memory systems may include a memory storage including at least a first stripe and a second stripe, the first stripe including data pages corresponding to the first stripe and a first parity page suitable for storing a first XOR parity, and the second stripe including data pages corresponding to the second stripe and a second parity page suitable for storing a second XOR parity, the data pages and parity pages being stored over a plurality of memory dies, wherein each memory die includes a number of planes; and a controller suitable for cyclically interleaving the data pages corresponding to the first stripe and the data pages corresponding to the second stripe.

Abstract: A digital signal processing (DSP) system includes an analog to digital converter, program random access memory (PRAM), N switching devices, and a control module. The analog to digital converter is configured to convert samples of an analog signal into digital samples. The PRAM includes: N PRAM blocks, where N is an integer greater than one; and code for M digital signal processing functions stored in the N PRAM blocks, where M is an integer greater than one. The N switching devices are configured to connect and disconnect the N PRAM blocks, respectively, to and from a power source. The control module is configured to: control the N switching devices; and execute selected ones of the M digital signal processing functions on the digital samples to produce an output.