Abstract: A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

Abstract: A signal sending method includes: acquiring a first data signal and a first auxiliary signal to be sent to a first opposite-side device, wherein the first data signal is to be sent via PCle optical-fiber links of a quantity N, that is ?2; determining a first-signal-intensity sequence corresponding to the first auxiliary signal, wherein the first-signal-intensity sequence includes first signal intensities of a quantity M, that is ?2; and according to the first-signal-intensity sequence, converting the first data signal into first optical signals of the quantity N, and via the PCIe optical-fiber links of the quantity N, sending the first optical signals of the quantity N to the first opposite-side device, wherein signal intensities of the first optical signals of the quantity M among the first optical signals of the quantity N and the first signal intensities of the quantity M have a one-to-one correspondence relation therebetween.

Abstract: The embodiments of the present application provide a signal transmitting method and device, a non-volatile readable storage medium and an electronic device.

Abstract: The embodiments of the present application provide a signal sending method and apparatus, a non-volatile readable storage medium and an electronic device, wherein the method includes: acquiring a first data signal and a first auxiliary signal that are to be sent to a first opposite-side device, wherein the first data signal is to be sent to the first opposite-side device via PCIe optical-fiber links of a quantity N, wherein N is a positive integer greater than or equal to 2; determining a first-signal-intensity sequence corresponding to the first auxiliary signal, wherein the first-signal-intensity sequence includes first signal intensities of a quantity M, wherein M is greater than or equal to 2; and according to the first-signal-intensity sequence, converting the first data signal into first optical signals of the quantity N, and via the PCIe optical-fiber links of the quantity N, sending the first optical signals of the quantity N to the first opposite-side device, wherein signal intensities of the first o

Abstract: Disclosed are a method and apparatus for establishing a Peripheral Component Interconnect Express (PCIe) optical interconnection link, a device, a non-volatile readable storage medium, and a system. The method includes: acquiring an upstream data signal transmitted through an electrical path, and detecting whether at least one Electrical Idle Ordered Set (EIOS) exists in the upstream data signal; recording a current link rate of the PCIe optical interconnection link, and determining whether the transmission of the at least one EIOS is completed by counting the at least one EIOS; and generating a target signal sequence of a corresponding rate according to the current link rate in a case where the transmission of the at least one EIOS is completed, and transmitting the target signal sequence to an opposite end through the PCIe optical interconnection link.

Abstract: A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

Abstract: A method for designing PCB pads: using a drill bit of a first size to drill through a PCB from a first side; using a drill bit of a second size to back-drill a second side of the PCB so as to form a pyramid-shaped through hole; setting the connection means of a second layer and third layer of an inner layer of the PCB that comprises the pyramid-shaped through hole to full connection; and disposing a pad of a third size on a first layer of the inner layer, and disposing a pad of a fourth size on the last layer of the inner layer, wherein the fourth size is bigger than the third size, the fourth size is bigger than the second size, the second size is bigger than the first size, and the third size is bigger than the first size.

Abstract: The present disclosure provides a control device of a water heating apparatus, a water heating apparatus and a control method thereof. The control device comprises a storage, a processor and a heater, the storage stores a usage state value of the water heating apparatus during a first period and provides the usage state value to the processor connected thereto, the usage state value includes a mean value of outlet water temperature TH, a mean value of outlet water amount LU and a mean value of inlet water temperature TL, the processor determines an output value in accordance with the usage state value and provides the output value to the heater connected thereto, the output value includes a water amount LX to be heated and a water temperature T to be reached, the heater performs heating during a second period in accordance with the output value from the processor.

Abstract: The present disclosure provides a control device of a water heating apparatus, a water heating apparatus and a control method thereof. The control device comprises a storage, a processor and a heater, the storage stores a usage state value of the water heating apparatus during a first period and provides the usage state value to the processor connected thereto, the usage state value includes a mean value of outlet water temperature TH, a mean value of outlet water amount LU and a mean value of inlet water temperature TL, the processor determines an output value in accordance with the usage state value and provides the output value to the heater connected thereto, the output value includes a water amount LX to be heated and a water temperature T to be reached, the heater performs heating during a second period in accordance with the output value from the processor.

Abstract: A motion-gesture detection equipment includes a display screen, an image-acquiring device and a processor. The image-acquiring device is to acquire in real time motion-gesture information of an exercising person. The processor is to compare in real time the motion-gesture information with standard motion-gesture information, and send a comparison result to the display screen for displaying in real time.