Patents by Inventor Caitlin W. Weinstein

Caitlin W. Weinstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Internally reinforced bond pads
    Patent number: 7273804
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: September 25, 2007
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Method of polishing C4 molybdenum masks to remove molybdenum peaks
    Patent number: 7025891
    Abstract: A method of treating a molybdenum (moly) mask used in a C4 process to pattern C4 contacts. The moly mask has a wafer side which contacts a wafer during the C4 process and has a rough surface that includes spikes/projections of moly. The moly mask also has a non wafer side and a plurality of holes extending through the mask to pattern C4 contacts in the C4 process. An adhesive layer, such as an adhesive tape, is applied to the non wafer side of the moly mask, to enable a polishing tool to pull a vacuum on the non wafer side of the moly mask in spite of the presence of the holes to secure the moly mask during a subsequent polishing step. The tape also functions as a cushion so that defects on the non wafer side of the moly mask do not replicate through the moly mask to the polished wafer side of the moly mask.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: April 11, 2006
    Assignee: International Business Machines Corporation
    Inventors: Steven R. Codding, Timothy C. Krywanczyk, Joseph D. Danaher, John C. Malinowski, James R. Palmer, Melvin T. Kelly, Caitlin W. Weinstein, Wolfgang Sauter
  • Internally reinforced bond pads
    Patent number: 6864578
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: March 8, 2005
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Internally reinforced bond pads
    Publication number: 20040195642
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein