Patents by Inventor Cal Hardie

Cal Hardie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transducer signal wire termination
    Patent number: 5995325
    Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.
    Type: Grant
    Filed: April 20, 1994
    Date of Patent: November 30, 1999
    Assignee: Seagate Technology, Inc.
    Inventors: Mark Maggio, Tom Metzner, Steven Eckerd, Loren Skarky, Yoshiki Midori, Ray-Chung Yu, Cal Hardie
  • Method of electrically connecting a transducer to a preamplifier
    Patent number: 5555619
    Abstract: A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: September 17, 1996
    Assignee: Seagate Technology, Inc.
    Inventors: Mark Maggio, Tom Metzner, Steven Eckerd, Loren Skarky, Yoshiki Midori, Cal Hardie, Ray Yu