Abstract: Multilayer components, assemblies, and methods for forming multilayer components and assemblies are provided. For example, a multilayer component includes a plurality of dielectric layers, including an outer dielectric layer, that are stacked in a Z-direction to form a substrate having a top and a bottom; a conductive layer formed over a respective one dielectric layer and disposed within the stacked plurality of dielectric layers such that the conductive layer is spaced apart from both the top and the bottom of the substrate along the Z-direction; a shield layer formed over the outer dielectric layer; and a plurality of vias extending from the shield layer. The plurality of vias can be electrically connected to a ground defined on a substrate of a device; the multilayer component can be mounted on a surface of the device or embedded within the device.