Abstract: An apparatus for receiving and holding a printed circuit board. The apparatus includes a cover having a bottom surface upon which an adhesive is deposited. The apparatus also includes a frame coupled to the cover for receiving the printed circuit board. The frame has a bonding surface that includes a plurality of adhesive thickness control bumps. Each of the plurality of adhesive thickness control bumps is of a predefined height such that the bondline thickness of the adhesive is limited when the bottom surface of the cover is bonded to the frame. For a second embodiment, the cover further includes a plurality of feet extending from the bottom surface of the cover, and the frame further includes a plurality of slots for receiving the plurality of feet. Each of the plurality of slots includes a lip and each of the plurality of feet has a latch tab formed therein such that positioning the feet in the slots causes the latch tabs to catch the lips of the slots such that the cover is locked to the frame.