Patents by Inventor Callie A. Schieffer

Callie A. Schieffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS FOR ACHIEVING METAL FILL IN SMALL FEATURES
    Publication number: 20140174938
    Abstract: A method of electroplating on a workpiece having a sub-30 nm feature generally includes applying a chemistry to the workpiece, the chemistry including a halide ion concentration in the range of about 55 ppm to about 250 ppm and a metal cation solute species, and applying an electric waveform for less than about 5 seconds, wherein the electric waveform includes a period of ramping of current and a period of pulse plating.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 26, 2014
    Applicant: APPLIED Materials, Inc.
    Inventors: Callie A. Schieffer, Robert O. Miller
  • SEED LAYER PASSIVATION
    Publication number: 20130127057
    Abstract: A microfeature workpiece generally includes a first conducting layer, a chemisorbed layer or a monolayer directly on the first conducting layer, and a second conducting layer. The chemisorbed layer or monolayer includes a first material that may be selected from the group consisting of nitrogen-containing compounds, sulfur-containing compounds, and mixtures thereof.
    Type: Application
    Filed: January 18, 2013
    Publication date: May 23, 2013
    Inventors: Callie A. Schieffer, Ismail T. Emesh
  • Seed layer passivation
    Patent number: 8357599
    Abstract: A method of processing a microfeature workpiece generally includes depositing a first conducting layer, at least partially reducing oxides on the first conducting layer to provide a reduced first conducting layer, and exposing the reduced first conducting layer to a substantially oxygen-free environment to provide a passivated first conducting layer. A microfeature workpiece generally includes a first conducting layer, a monolayer directly on the first conducting layer, and a second conducting layer.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: January 22, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Callie A. Schieffer, Ismail T. Emesh
  • SEED LAYER PASSIVATION
    Publication number: 20120205793
    Abstract: A method of processing a microfeature workpiece generally includes depositing a first conducting layer, at least partially reducing oxides on the first conducting layer to provide a reduced first conducting layer, and exposing the reduced first conducting layer to a substantially oxygen-free environment to provide a passivated first conducting layer. A microfeature workpiece generally includes a first conducting layer, a monolayer directly on the first conducting layer, and a second conducting layer.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 16, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Callie A. Schieffer, Ismail T. Emesh