Abstract: A device for providing a rapid, secure and insulated electrical splice by solderless means, comprising a body having a channel exposed along the upper surface of the body. The ends of the channel being connected to a first and a second opening on the ends of the body to accept the wires to be spliced. A substantially flat, conductive interconnection bar is positioned in the upper portion of the channel. Conductive prongs, projecting downward from the lower side of the interconnection bar, pierce the insulation of the wires to make the splice. An inverted "V" shaped cut in the prongs permit accepting a variety of wire sizes.