Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.

Abstract: Various embodiments are directed to an optical sensor configured to transmit and receive optical radiation while minimizing optical noise, such as crosstalk. An example optical sensor includes an optical radiation source configured to direct optical radiation at a target object, an optical radiation receiver configured to receive reflected optical radiation off the target object, and a housing cap. The housing cap includes a transmission opening having a lower portion and an upper portion positioned to direct optical radiation toward the target object, and a receiving opening positioned to received reflected optical radiation. A first portion of the upper portion of the transmission opening includes a vertical surface that is substantially parallel to an optical transmission axis. A second portion of the upper portion of the transmission opening comprises an angled surface, progressing into the transmission opening from an outer surface of the housing cap at a transmission opening angle.

Abstract: A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.