Patents by Inventor Calvert Tan

Calvert Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of forming through-silicon-via with sacrificial layer
    Patent number: 9076655
    Abstract: A semiconductor device can be formed by first providing a semiconductor wafer, and forming a conductive via into the semiconductor wafer. A portion of the semiconductor wafer can be removed so that the conductive via extends above a surface of the semiconductor wafer. A first insulating layer can be formed over the surface of the semiconductor wafer and the conductive via, followed by a second insulating layer, the second insulating layer having a different material composition than the first insulating layer. Portions of the insulating layers can be removed to expose the conductive via.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: July 7, 2015
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Duk Ju Na, Calvert Tan, Chang Beom Yong
  • Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer
    Publication number: 20140199838
    Abstract: A semiconductor device can be formed by first providing a semiconductor wafer, and forming a conductive via into the semiconductor wafer. A portion of the semiconductor wafer can be removed so that the conductive via extends above a surface of the semiconductor wafer. A first insulating layer can be formed over the surface of the semiconductor wafer and the conductive via, followed by a second insulating layer, the second insulating layer having a different material composition than the first insulating layer. Portions of the insulating layers can be removed to expose the conductive via.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Duk Ju Na, Calvert Tan, Chang Beom Yong