Abstract: A method of synthesizing multilayer heterostructures including an inorganic oxide layer residing on a solid substrate is described. Exemplary embodiments include producing an inorganic oxide layer on a solid substrate by a liquid coating process under relatively mild conditions. The relatively mild conditions include temperatures below 225° C. and pressures above 9.4 mb. In an exemplary embodiment, a solution of diethyl aluminum ethoxide in anhydrous diglyme is applied to a flexible solid substrate by slot-die coating at ambient atmospheric pressure, and the diglyme removed by evaporation. An AlOx layer is formed by subjecting material remaining on the solid substrate to a relatively mild oven temperature of approximately 150° C. The resulting AlOx layer exhibits relatively high light transmittance and relatively low vapor transmission rates for water. An exemplary embodiment of a flexible solid substrate is polyethylene napthalate (PEN). The PEN is not substantially adversely affected by exposure to 150° C.

Abstract: A method of synthesizing multilayer heterostructures including an inorganic oxide layer residing on a solid substrate is described. Exemplary embodiments include producing an inorganic oxide layer on a solid substrate by a liquid coating process under relatively mild conditions. The relatively mild conditions include temperatures below 225° C. and pressures above 9.4 mb. In an exemplary embodiment, a solution of diethyl aluminum ethoxide in anhydrous diglyme is applied to a flexible solid substrate by slot-die coating at ambient atmospheric pressure, and the diglyme removed by evaporation. An AlOx layer is formed by subjecting material remaining on the solid substrate to a relatively mild oven temperature of approximately 150° C. The resulting AlOx layer exhibits relatively high light transmittance and relatively low vapor transmission rates for water. An exemplary embodiment of a flexible solid substrate is polyethylene napthalate (PEN). The PEN is not substantially adversely affected by exposure to 150° C.

Abstract: A heat transfer system capable of being coupled to at least one temperature controlled zone, the elements of the system comprising: (i) at least one liquid refrigerant line; (ii) at least one expansion valve selected for R22 or R422D; (iii) at least one evaporator (iv) at least one compressor; (v) at least one condenser; (vi) at least one vapor refrigerant line; and wherein all of the elements have an inlet side and an outlet side and elements (i) through (vi) are in fluid communication together and contains R422D; and the system further comprising a sensing element communicatively coupled to the outlet side of at least one evaporator and at least one expansion valve and at least one sensing element contains a fluid selected to work when R22 is in the condenser-to-evaporator circuit, or R422D. Further disclosed are methods for retrofitting R22 containing heat transfer systems, including refrigerators and air conditioners. Also disclosed are refrigerators and air conditioners containing only R422D.

Abstract: The present invention provides a method for producing Group III nitride materials by converting a Group III azide of the formula: (R1R2N)2M1N3 under conditions sufficient to produce a Group III nitride material of the formula: M1N wherein each of R1 and R2 is independently a hydrocarbyl; and M1 is a Group III metal.