Patents by Inventor Calvin E. Wells

Calvin E. Wells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for mounting a chip package to a chassis of a computer
    Patent number: 6018465
    Abstract: An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided is an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided is an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided is an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
    Type: Grant
    Filed: December 31, 1996
    Date of Patent: January 25, 2000
    Assignee: Intel Corporation
    Inventors: Shekhar Yeshwant Borkar, Robert S. Dreyer, Hans Mulder, Naomi Obinata, Calvin E. Wells
  • Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
    Patent number: 5969944
    Abstract: A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: October 19, 1999
    Assignee: Intel Corporation
    Inventors: Shekhar Yeshwant Borkar, Robert S. Dreyer, Hans Mulder, Naomi Obinata, Calvin E. Wells