Abstract: An electronic just-in-time learning and training system that is integrated into a user workflow to provide users with the knowledge they require to complete the tasks in the workflow and to provide meaningful and impactful training to users or advancement along a learning or training path. User tasks are matched to training modules in a training database to assist with completion of a task while a user profile tracks user training to deliver the most appropriate training modules. The system tracks completion of training modules to guide the user with training and advancement and to offer the user opportunities for additional certification and learning.

Abstract: An electronic just-in-time learning and training system that is integrated into a user workflow to provide users with the knowledge they require to complete the tasks in the workflow and to provide meaningful and impactful training to users or advancement along a learning or training path. User tasks are matched to training modules in a training database to assist with completion of a task while a user profile tracks user training to deliver the most appropriate training modules. The system tracks completion of training modules to guide the user with training and advancement and to offer the user opportunities for additional certification and learning.

Abstract: A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. Various embodiments of the present invention provide an apparatus and method for attaching a thin film head to a beam. Other embodiments of the present invention include a system, method and apparatus for dicing a thin film head on a wafer.

Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Abstract: A magnetic head includes a substrate having a first tape bearing surface and a second (outrigger) tape bearing surface, preferably with a slot therebetween. A plurality of elements (readers and/or writers) are coupled to the substrate and positioned towards the first tape bearing surface. The first and second tape bearing surfaces lie along planes, the planes being offset from one another spatially and/or angularly. The second tape bearing surface, like typical flat profile heads, induces a small spacing between a tape passing thereover and its tape bearing surface. The second tape bearing surface is positioned below the plane of the first tape bearing surface, thereby creating the proper wrap angle of the tape relative to the first tape bearing surface.

Abstract: A magnetic head includes a first array of elements associated with a first data format and a second array of elements associated with a second data format, the elements being selected from a group consisting of readers, writers, and combinations thereof. The first and second arrays of elements are adjacent each other in a direction transverse to a direction of travel of a magnetic medium over the head.

Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.