Abstract: A residential bathtub or shower is combined with a catch drain or basin below and in proximity with the tub or shower in a unitary structure. Most components of a heat pump are located in the catch basin. A hot water tank is outside of the catch basin but located in the immediate vicinity such as at an end of the tub or above the tub or alongside of the tub. The hot tank includes a heat exchanger that is the heat pump condenser, bringing heat to the hot tank for warming household water. Hot water flows from the tank into the tub or shower for bathing and then drains into the catch basin where heat exchangers remove heat before draining or reuse in flushing a toilet.

Abstract: A battery cabinet with a plurality of spaced apart shelves of equal width and depth. Each shelf supports a removable battery module. In turn, each module has a fixed adapter that holds batteries as a battery bank where the module and adapter occupy most of the space between shelves. Battery cells are vertically or horizontally aligned with terminals joined to comb-shaped straps with blades joined to battery terminals. The space between blades allows for thermal expansion without wear on terminals.

Abstract: An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect.

Abstract: An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect.

Abstract: A foundation fumigation system includes a fumigant container assembly. The fumigant container assembly contains a quality of fumigant to be applied around a foundation of a structure. The fumigant container assembly has a valve portion for selectively releasing the fumigant. A distribution control and monitoring assembly is operationally coupled to the fumigant container assembly. The distribution control and monitoring assembly facilitates the distribution of the fumigant. A distribution system is operationally coupled to the distribution control and monitoring assembly. The distribution system has at least one distribution member environmentally couplable to the fumigant container assembly. The distribution member facilitates distributing the fumigant around the foundation. The distribution system has a plurality of nozzle members. Each one of the nozzle members is in environmental communication with the distribution member.

Abstract: Disclosed is a compound of Formula (I), wherein: L is a linking agent; B is a binding agent; X is an atom or group suitable for attaching L to the glycerol chain; and R is a straight chain saturated or unsaturated alkyl group having from 8 to 30 carbon atoms, substituted with M? or M? wherein at least one of M? and/or M? is a detectable label. The compound can be used as a lipase substrate in a solid phase-based assay system, such as a scintillation proximity assay, to detect lipase enzyme activity.

Abstract: A modular heat recovery ventilation system includes a modular heat exchanger and a modular apparatus spaced from the heat exchanger for delivering both fresh air and exhaust air to the heat exchanger. The apparatus includes separate blowers for generating two separate air streams. The apparatus includes an access plate at the bottom thereof allowing access to the interior of the enclosure of the apparatus through a ceiling.

Abstract: Disclosed is a compound of Formula (I), wherein: L is a linking agent; B is a binding agent; X is an atom or group suitable for attaching L to the glycerol chain; and R is a straight chain saturated or unsaturated alkyl group having from 8 to 30 carbon atoms, substituted with M′ or M″ wherein at least one of M′ and/or M″ is a detectable label. The compound can be used as a lipase substrate in a solid phase-based assay system, such as a scintillation proximity assay, to detect lipase enzyme activity.

Abstract: Damper apparatus includes a housing and dividers in the interior of the housing. One of the dividers forms a plenum and two openings leading from the plenum to an air flow outlet of the housing. Separate damper blades control air flow through the openings. A second divider divides the housing interior into separate passageways, one passageway in communication with one opening and the other passageway in communication with the other opening.