Abstract: An apparatus, according to one embodiment, includes at least one reading die coupled to a pedestal of an associated read beam, each reading die having an array of read transducers extending parallel to a longitudinal axis of the reading die. At least one writing die is coupled to a pedestal of an associated write beam, each writing die having an array of write transducers extending parallel to a longitudinal axis of the writing die. The read and write beams are coupled together thereby forming a head. At least one region of at least one of the dice is cantilevered over the associated beam. Widths of the reading and writing dice measured in a direction of tape travel thereover are substantially the same. Widths of the pedestals of the read and write beams measured in the direction of tape travel thereover are substantially the same.

Abstract: A method, in accordance with one aspect of the present invention, includes forming various layers of a data read transducer structure and of a lower shield layer of a servo read transducer structure in an array with the data read transducer structure in common fabrication steps. The formed dielectric layers of both read transducer structures, coupled with the unique shield structure of the data read transducer structure, work in concert to provide robust resistance to asperity-induced shorting while also lower smaller read gap thickness.

Abstract: In one general approach, an apparatus includes a read transducer structure having a media facing surface. The read transducer structure has a lower shield, and an upper shield formed above the lower shield. The upper and lower shields providing magnetic shielding. A current-perpendicular-to-plane sensor is positioned between the upper and lower shields. A dielectric layer extends into one of the shields from the media facing surface. The dielectric layer extends into the one of the shields for a distance that is less than a height of the one of the shields. Preferably, a first dielectric layer extends into the lower shield from the media facing surface, and a second dielectric layer extends into the upper shield from the media facing surface.

Abstract: An apparatus, in accordance with one aspect of the present invention, includes a module having a media facing surface. The module comprises the following components. A sensor is recessed from the media facing surface. A flux guide extends from the media facing surface toward the sensor. A soft bias layer is positioned on opposite sides of the sensor in a cross-track direction. A stabilization layer is located above the sensor, flux guide and soft bias layer for stabilizing the soft bias layer. A nonmagnetic exchange break layer is positioned above the sensor and the flux guide for magnetically decoupling the sensor and the flux guide from the stabilization layer.

Abstract: An apparatus, according to one embodiment, includes at least two write transducers positioned a predefined distance apart in a first direction. Outer surfaces of pole tips of the write transducers are substantially coplanar. Write gaps are defined between the pole tips of the write transducers. Planes of the write gaps are oriented substantially perpendicular to the first direction. Coils are positioned to create flux in a magnetic yoke of each write transducer upon energization thereof. The apparatus also includes a mechanism for assisting in orienting a module having two or more sensors of interest relative to the write gaps.

Abstract: An approach to forming an electronic device assembly that includes a plurality of interconnect pads on an electronic device, an interconnect die with a first set of interconnect pads adjacent to a first edge of the interconnect die connecting to a second set of interconnect pads adjacent to a second edge of the interconnect die, where a first set of connections between the plurality of interconnects on the electronic device and the first set of interconnect pads on the interconnect die occurs. Furthermore, the electronic assembly includes a second set of connections between the second set of interconnects on the interconnect die and a set of interconnect pads on a flex cable.

Abstract: An apparatus, in accordance with one approach, includes a module having a first array of read transducers. A first electrical shielding layer is positioned above the first array of read transducers. An array of write transducers is positioned above the first electrical shielding layer. A second electrical shielding layer is positioned above the array of write transducers. A second array of read transducers is positioned above the second electrical shielding layer.

Abstract: A magnetic head according to one embodiment includes a substrate having a tape bearing surface; a plurality of elements coupled to the substrate and positioned towards the first tape bearing surface, the elements being selected from a group consisting of readers, writers, and combinations thereof; and an outrigger held in a fixed position relative to the substrate, the outrigger having a tape bearing surface; wherein the outrigger tape bearing surface and the substrate tape bearing surface lie along planes, the planes being offset from one another.

Abstract: In one embodiment, a system comprises a magnetic head, a protective coating on a media-facing side of the head, and an indentation in the protective coating having a dimension that, when the protective coating wears, is indicative of an amount of wear of the protective coating. A method, in another embodiment, comprises creating an indentation in a protective coating of a magnetic head, the indentation having a dimension that, when the protective coating wears, is indicative of an amount of wear of the protective coating. In another embodiment, a method comprises visually inspecting indentations in a protective coating of a magnetic head, wherein at least two of the indentations have differing dimensions that, when the protective coating wears, are indicative of the amount of wear of the protective coating. The method also includes estimating an amount of wear of the protective coating based on the visual inspection.

Abstract: A structure according to one embodiment includes a substrate having a media facing side; and a thin film stack formed on the substrate, the thin film stack including magnetic films and insulating films, wherein the thin film stack is recessed from a plane extending along the media facing side of the substrate, wherein the magnetic films are recessed more than the insulating films, wherein the magnetic films each have a substantially flat media facing surface, wherein the insulating films each have a substantially flat media facing surface.

Abstract: A magnetic head in one embodiment includes a plurality of components separated from each other by insulative portions, one of the components being a substrate; at least one connective element electrically coupling the components together; and a chiplet having at least one of read transducers and write transducers. A magnetic head in another embodiment includes a plurality of components separated from each other by insulative portions; side bars flanking the substrate; and at least one connective element electrically coupling the components together. A magnetic head in another embodiment includes a plurality of components separated from each other by insulative portions; and at least one connective element electrically coupling the components together, wherein the at least one connective element is positioned in at least one of the insulative portions, the at least one connective element having no other function than to electrically connect the components adjacent thereto.

Abstract: In one embodiment, a magnetic head includes a substrate having a media support surface; a gap coupled to the substrate, the gap having at least one of a magnetoresistive (MR) sensor and a writer; a closure coupled to the gap on a side thereof opposite the substrate, said closure forming a portion of the media support surface; and a material formed in one or more recesses extending into the media support surface of at least one of the substrate and the closure.

Abstract: A system comprises a head having a tape bearing surface and an array of transducers in the tape bearing surface, the transducers being selected from a group consisting of readers, writers and servo readers, a length of the array being defined between outer transducers thereof, the head having a feature that induces formation of a larger spacing between a tape and portions of the tape bearing surface positioned laterally to the array in a direction about perpendicular to a direction of tape travel thereacross than between the tape and a contiguous portion of the tape bearing surface wherein the feature has a continuous length that is at least as long as the plurality of transducers, wherein the feature has a continuous length that is at least as long as the plurality of transducers.

Abstract: A magnetic head in one embodiment includes a plurality of components separated from each other by insulative portions, one of the components being a substrate; at least one connective element electrically coupling the components together; and a chiplet having at least one of read transducers and write transducers. A magnetic head in another embodiment includes a plurality of components separated from each other by insulative portions; side bars flanking the substrate; and at least one connective element electrically coupling the components together. A magnetic head in another embodiment includes a plurality of components separated from each other by insulative portions; and at least one connective element electrically coupling the components together, wherein the at least one connective element is positioned in at least one of the insulative portions, the at least one connective element having no other function than to electrically connect the components adjacent thereto.

Abstract: A magnetic head in one embodiment comprises a plurality of components separated from each other by insulative portions; and at least one connective element coupling the components together. A magnetic tape head in another embodiment comprises a substrate; a closure separated from the substrate by an insulative portion; and at least one connective element coupling the substrate and closure together.

Abstract: An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.

Abstract: A system in one embodiment includes first and second modules, each module having a substrate, a closure, and a gap situated therebetween, the gap comprising transducers selected from readers and writers; wherein the closures face each other, wherein the closure and the substrate of each module form a flat tape bearing surface, wherein a module spacing is defined as a distance from a point proximate to the transducers in the gap of the first module to a point proximate to the transducers in the gap of the second module, wherein the module spacing is less than 1.3 mm and greater than 0 mm.

Abstract: A magnetic head according to one embodiment includes a substrate; a sensor formed above the substrate; a second shield formed above the sensor and the substrate; a first insulation layer positioned between the substrate and the sensor; a second insulation layer positioned between the sensor and the second shield; and a nonmagnetic, non-electrically insulative layer formed between the substrate and the sensor.

Abstract: A structure according to one embodiment includes a substrate having a media facing side; and a thin film stack formed on the substrate, the thin film stack including magnetic films and insulating films, wherein the thin film stack is recessed from a plane extending along the media facing side of the substrate, wherein the magnetic films are recessed more than the insulating films, wherein the magnetic films each have a substantially flat media facing surface, wherein the insulating films each have a substantially flat media facing surface.

Abstract: A method according to one embodiment includes ion milling at a first angle of greater than about 25 degrees from normal relative to a media facing side of a thin film region of a magnetic head or component thereof for recessing the thin film region at about a constant rate for films of interest of the thin film region, planes of deposition of the films being oriented about perpendicular to the media facing side; and ion milling or plasma sputtering at a second angle of less than about 25 degrees from normal relative to the media facing side of the thin film region for recessing magnetic films therein faster than insulating films therein, the second angle being smaller than the first angle.