Abstract: A fixture system includes a housing configured to be mounted in an upper region of a room or area. A light source is supported by the housing for providing visible light to illuminate at least a portion of the room or area. An ultraviolet radiation (UVR) system is supported by the housing for emitting UVC radiation in an upper region of the room or area. The UVR system includes at least one UVC emitting source and an optic member configured to direct UVC radiation in a pattern having a vertical width dimension that is above a threshold height from a floor or ground in the room or area.

Abstract: A trim member for a lighting device module includes an annular body having a first end portion that is connectable to a housing of the lighting device module and has a light receiving opening, and a second end portion opposite to the first end portion. The second end portion has a light emitting opening and is configured to be positioned outside of the housing of the lighting device module. A first curved or tapered surface extends from the light receiving opening toward the light emitting opening, and has a diameter that increases toward the light receiving opening. A second curved or tapered surface extends from the first curved or tapered surface to the light emitting opening, and has a diameter that increases toward the light emitting opening.

Abstract: A lighting device system includes a lighting device module having a module housing configured to be selectively inserted through an opening in a panel or a base. Driver electronics are configured to be electrically coupled to the lighting device module. A heat sink member is located adjacent the opening in the panel or the base. A movable biasing device has a first position to apply a bias force on the module housing, pressing the module housing toward the heat sink member to increase thermal transfer. The moveable biasing device has a second position to provide improved access to the driver electronics through the opening in the panel or base relative to the first position. The movable biasing device is selectively moveable from the first position to the second position, or from the second position to the first position.

Abstract: A trim member for a lighting device module includes an annular body having a first end portion that is connectable to a housing of the lighting device module and has a light receiving opening, and a second end portion opposite to the first end portion. The second end portion has a light emitting opening and is configured to be positioned outside of the housing of the lighting device module. A first curved or tapered surface extends from the light receiving opening toward the light emitting opening, and has a diameter that increases toward the light receiving opening. A second curved or tapered surface extends from the first curved or tapered surface to the light emitting opening, and has a diameter that increases toward the light emitting opening.

Abstract: A lighting device system includes at least one lighting device module having a module housing configured to be inserted at least partially through an opening in a panel, and at least one heat sink member having a contact surface. The at least one heat sink member is located adjacent the opening in the panel. The module housing is held in contact with the contact surface of the at least one heat sink member when the module housing is inserted at least partially through the opening in the panel in an installed state. The module housing is configured to be selectively withdrawn from the contact surface of the heat sink member, through the opening in the panel.

Abstract: A moveable mount supports a lighting device assembly and driver electronics. The moveable mount includes a base having a light opening, and a light engine support bracket assembly movably secured to the base. The light engine support bracket is configured to support the lighting device assembly and the driver electronics, for movement relative to the base between a first position in which an optic or a light source of the light engine assembly is aligned with the light opening of the base to direct light through the light opening, and a second position in which the driver electronics is aligned with the light opening of the base.

Abstract: A moveable mount supports a lighting device assembly and driver electronics. The moveable mount includes a base having a light opening, and a light engine support bracket assembly movably secured to the base. The light engine support bracket is configured to support the lighting device assembly and the driver electronics, for movement relative to the base between a first position in which an optic or a light source of the light engine assembly is aligned with the light opening of the base to direct light through the light opening, and a second position in which the driver electronics is aligned with the light opening of the base.

Abstract: A lighting device system has a lighting device module including a movable heat sink member configured to be received within the inner volume of a module housing. At least one rail on an inner surface of the module housing or on the movable heat sink member is received in a corresponding one or more grooves on the other of the inner surface of the module housing or the movable heat sink member. The movable heat sink member is slidably movable along the at least one rail or groove. A light source is attached to the heat sink member for directing light out of the first open end of the module housing, and is movable with the heat sink member to change a tilt angle of the light source.

Abstract: A lighting device assembly includes a light source attached to a heat sink member, a first optic device and a mounting housing configured to be secured in or to a ceiling, wall or other object, and to hold the heat sink member. A second optic device including a second optic member is configured to receive light emitted in a first direction from the light emitting surface of the first optic device and to emit light in a second direction that is transverse to the first direction. A connection mechanism selectively connects the second optic device to the mounting housing, for selective disconnection from the mounting housing.

Abstract: A driver housing for holding driver electronics of a lighting device system includes a first housing portion and a second housing portion. The first housing portion is configured to hold and retain the driver electronics. The second housing portion is configured to contain or hold one or more electrical connectors for connecting the first one or more electrical conductors to the one or more power source conductors. A pivotal joint connects the first housing portion and the second housing portion together, for pivotal movement relative to each other. The pivotal joint improves the ease and ability of installation of the driver housing in small or narrow spaces.

Abstract: A fixture system includes a housing configured to be mounted in an upper region of a room or area. A light source is supported by the housing for providing visible light to illuminate at least a portion of the room or area. An ultraviolet radiation (UVR) system is supported by the housing for emitting UVC radiation in an upper region of the room or area. The UVR system includes at least one UVC emitting source and an optic member configured to direct UVC radiation in a pattern having a vertical width dimension that is above a threshold height from a floor or ground in the room or area.

Abstract: A lighting device assembly includes: a heat sink; a light source attached to one end of the heat sink; an optic assembly to pivot an optic about the light source; and a housing member having a cavity in which at least a portion of the optic assembly is received. The optic is to be telescopically adjusted within the optic assembly to adjust a focal point between the light source and the optic.

Abstract: A lighting device assembly includes: a heat sink; a light source attached to one end of the heat sink; an optic assembly to pivot an optic about the light source; and a housing member having a cavity in which at least a portion of the optic assembly is received. The optic is to be telescopically adjusted within the optic assembly to adjust a focal point between the light source and the optic.

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract: A printed circuit board (PCB) assembly is provided that includes a PCB, an integrated circuit package, an electromagnetic interference (EMI) shield ring, and a heat sink lid. A first surface of the package is mounted to a first surface of the PCB. The EMI shield ring is mounted to the first surface of the PCB in a ring around the package. A first surface of the heat sink lid includes a recessed region and first and second supporting portions separated by the recessed region. The heat sink lid is mated with the EMI shield ring such that the package is positioned in an enclosure formed by the EMI shield ring and the recessed region of the heat sink lid. A second surface of the package may interface with a surface of the recessed region.

Abstract: An integrated circuit package includes a substrate having opposing first and second surfaces, a flip chip integrated circuit die, and a heat sink. A first surface of die is mounted to the first surface of the substrate by a plurality of electrically conductive solder bumps. The heat sink has a first surface that includes a recessed region extending along a length of the heat sink in the first surface and that includes first and second supporting portions separated by the recessed region. The first and second supporting portions are attached to the first surface of the substrate such that the die is positioned in the recessed region. A second surface of the die is attached to a surface of the recessed region.