Abstract: A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.

Abstract: Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

Abstract: A method of clipping and a clip configured to retain a cover onto a circuit board. The clip comprises a base plate having right and left sides. The base plate is configured to be fixed to the circuit board. The clip further comprises at least two right walls connected to and extending upwardly away from the base plate. Each of the right walls has a right upper portion. The clip further comprises at least two left walls connected to and extending upwardly away from the base. Each of the left walls has a left upper The right and left walls are spring biased inwardly so that at least a portion of the right and left upper portions overlap. In another embodiment, the right wall includes at least one opening and the left wall includes a middle segment extending towards the opening of the right wall.