Patents by Inventor Cameron E. LUCE

Cameron E. LUCE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Avalanche photodiode
    Patent number: 11322639
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an avalanche photodiode and methods of manufacture. The structure includes: a substrate material having a trench with sidewalls and a bottom composed of the substrate material; a first semiconductor material lining the sidewalls and the bottom of the trench; a photosensitive semiconductor material provided on the first semiconductor material; and a third semiconductor material provided on the photosensitive semiconductor material.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: May 3, 2022
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Mark D. Levy, Siva P. Adusumilli, John J. Ellis-Monaghan, Vibhor Jain, Ramsey Hazbun, Pernell Dongmo, Cameron E. Luce, Steven M. Shank, Rajendran Krishnasamy
  • Heterojunction bipolar transistors
    Patent number: 11195925
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a sub-collector region in a substrate; a collector region above the sub-collector region, the collector region composed of semiconductor material; an intrinsic base region composed of intrinsic base material surrounded by the semiconductor material above the collector region; and an emitter region above the intrinsic base region.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: December 7, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Judson R. Holt, Vibhor Jain, Qizhi Liu, Ramsey Hazbun, Pernell Dongmo, John J. Pekarik, Cameron E. Luce
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 11167980
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: November 9, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • AVALANCHE PHOTODIODE
    Publication number: 20210320217
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an avalanche photodiode and methods of manufacture. The structure includes: a substrate material having a trench with sidewalls and a bottom composed of the substrate material; a first semiconductor material lining the sidewalls and the bottom of the trench; a photosensitive semiconductor material provided on the first semiconductor material; and a third semiconductor material provided on the photosensitive semiconductor material.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 14, 2021
    Inventors: Mark D. LEVY, Siva P. ADUSUMILLI, John J. ELLIS-MONAGHAN, Vibhor JAIN, Ramsey HAZBUN, Pernell DONGMO, Cameron E. LUCE, Steven M. SHANK, Rajendran KRISHNASAMY
  • Sealed cavity structures with a planar surface
    Patent number: 11107884
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to sealed cavity structures having a planar surface and methods of manufacture. The structure includes a cavity formed in a substrate material and which has a curvature at its upper end. The cavity is covered with epitaxial material that has an upper planar surface.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: August 31, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Siva P. Adusumilli, Anthony K. Stamper, Laura J. Silverstein, Cameron E. Luce
  • HETEROJUNCTION BIPOLAR TRANSISTORS
    Publication number: 20210091195
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a sub-collector region in a substrate; a collector region above the sub-collector region, the collector region composed of semiconductor material; an intrinsic base region composed of intrinsic base material surrounded by the semiconductor material above the collector region; and an emitter region above the intrinsic base region.
    Type: Application
    Filed: January 2, 2020
    Publication date: March 25, 2021
    Inventors: Judson R. HOLT, Vibhor JAIN, Qizhi LIU, Ramsey HAZBUN, Pernell DONGMO, John J. PEKARIK, Cameron E. LUCE
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 10589991
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: March 17, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 10589992
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 17, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 10549987
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: February 4, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • SEALED CAVITY STRUCTURES WITH A PLANAR SURFACE
    Publication number: 20190363160
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to sealed cavity structures having a planar surface and methods of manufacture. The structure includes a cavity formed in a substrate material and which has a curvature at its upper end. The cavity is covered with epitaxial material that has an upper planar surface.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Inventors: Siva P. ADUSUMILLI, Anthony K. STAMPER, Laura J. SCHUTZ, Cameron E. Luce
  • Sealed cavity structures with a planar surface
    Patent number: 10446643
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to sealed cavity structures having a planar surface and methods of manufacture. The structure includes a cavity formed in a substrate material and which has a curvature at its upper end. The cavity is covered with epitaxial material that has an upper planar surface.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: October 15, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Siva P. Adusumilli, Anthony K. Stamper, Laura J. Schutz, Cameron E. Luce
  • SEALED CAVITY STRUCTURES WITH A PLANAR SURFACE
    Publication number: 20190229185
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to sealed cavity structures having a planar surface and methods of manufacture. The structure includes a cavity formed in a substrate material and which has a curvature at its upper end. The cavity is covered with epitaxial material that has an upper planar surface.
    Type: Application
    Filed: January 22, 2018
    Publication date: July 25, 2019
    Inventors: Siva P. ADUSUMILLI, Anthony K. STAMPER, Laura J. SCHUTZ, Cameron E. Luce
  • MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES
    Publication number: 20180201503
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES
    Publication number: 20180201502
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: March 9, 2018
    Publication date: July 19, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES
    Publication number: 20180179052
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: February 12, 2018
    Publication date: June 28, 2018
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Micro-Electro-Mechanical System (MEMS) structures and design structures
    Patent number: 9981842
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 29, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Method for forming micro-electro-mechanical system (MEMS) beam structure
    Patent number: 9969613
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: May 15, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 9938137
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: April 10, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • Micro-electro-mechanical system (MEMS) structures and design structures
    Patent number: 9932222
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: April 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White
  • MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES
    Publication number: 20160264410
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
    Type: Application
    Filed: May 24, 2016
    Publication date: September 15, 2016
    Inventors: Michael T. Brigham, Christopher V. Jahnes, Cameron E. Luce, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, Eric J. White