Abstract: A processing system for electroplating semiconductor wafers and similar substrates includes an electrolyte tank, at least one processing chamber connected to the electrolyte tank via fluid lines, and an electrolyte analyzer. The electrolyte analyzer may have a probe, such as a voltammetry probe, in the electrolyte tank, a pump, a reservoir and at least one valve, with these components connected via fluid lines to form a fluid loop. The valve may be switchable to provide a closed fluid loop where electrolyte circulates through the probe to analyze the electrolyte, and to provide an open fluid loop to removal of the used electrolyte and introduction of fresh electrolyte from the tank into the fluid loop. The used electrolyte may be moved to a facility drain and not returned to the electrolyte tank, to reduce risk of contamination.

Abstract: A processing system for electroplating semiconductor wafers and similar substrates includes an electrolyte tank, at least one processing chamber connected to the electrolyte tank via fluid lines, and an electrolyte analyzer. The electrolyte analyzer may have a probe, such as a voltammetry probe, in the electrolyte tank, a pump, a reservoir and at least one valve, with these components connected via fluid lines to form a fluid loop. The valve may be switchable to provide a closed fluid loop where electrolyte circulates through the probe to analyze the electrolyte, and to provide an open fluid loop to removal of the used electrolyte and introduction of fresh electrolyte from the tank into the fluid loop. The used electrolyte may be moved to a facility drain and not returned to the electrolyte tank, to reduce risk of contamination.