Abstract: An apparatus for clearing solids from a well including a housing with a jet pump, for positioning in a production string of the well, a tailpipe string carrying an elongate body to project out of a downhole end of the production string, a coupling to connect to inner tubing positioned within the production string for providing pressurised fluid to drive the jet pump, and a conduit which bypasses the jet pump in order to deliver pressurised fluid into the tailpipe string, wherein the tailpipe string includes a nozzle assembly to jet pressurised fluid into the well in order to agitate and stir up solids adjacent the elongate body and the elongate body includes an intake screen through which the solids are suctioned into an internal channel of the apparatus which is in fluid communication with an inlet of the jet pump, and wherein the jet pump has an exit for pumping the solids into a space between the apparatus and the production string in order to force the solids up-hole and out of the well.

Abstract: A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a flip-chip semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are electrically connected to a first leadframe portion and a second leadframe portion of the semiconductor package where the first leadframe portion and the second leadframe portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second leadframe portions, the first and second leadframe portions forming terminals of the current sense resistor.

Abstract: A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a flip-chip semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are electrically connected to a first leadframe portion and a second leadframe portion of the semiconductor package where the first leadframe portion and the second leadframe portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second leadframe portions, the first and second leadframe portions forming terminals of the current sense resistor.

Abstract: A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a flip-chip semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are electrically connected to a first leadframe portion and a second leadframe portion of the semiconductor package where the first leadframe portion and the second leadframe portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second leadframe portions, the first and second leadframe portions forming terminals of the current sense resistor.

Abstract: A current sense resistor integrated with an integrated circuit die housed in a chip-scale semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are to be electrically connected to a first conductive electrode and a second conductive electrode external to the chip-scale semiconductor package where the first conductive electrode and the second conductive electrode are physically separated from each other by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second conductive electrodes. In some embodiments, a semiconductor device including an integrated circuit die housed in a chip-scale semiconductor package includes a current sense resistor formed in a metal layer formed over a passivation layer of the integrated circuit die.

Abstract: A bi-directional comparator compares two input signals and applies a hysteresis level to the smaller input signal only after the output signal switches logical states and when the two input signals are within a predetermined range of each other. In one embodiment, the hysteresis applied to the smaller input signal is removed when the two input signals are no longer within the predetermined range of each other.

Abstract: A bi-directional comparator compares two input signals and applies a hysteresis level to the smaller input signal only after the output signal switches logical states and when the two input signals are within a predetermined range of each other. In one embodiment, the hysteresis applied to the smaller input signal is removed when the two input signals are no longer within the predetermined range of each other.

Abstract: A current sense resistor integrated with an integrated circuit die housed in a chip-scale semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are to be electrically connected to a first conductive electrode and a second conductive electrode external to the chip-scale semiconductor package where the first conductive electrode and the second conductive electrode are physically separated from each other by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second conductive electrodes. In some embodiments, a semiconductor device including an integrated circuit die housed in a chip-scale semiconductor package includes a current sense resistor formed in a metal layer formed over a passivation layer of the integrated circuit die.

Abstract: A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a flip-chip semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer having an array of metal pillars extending therefrom. The metal pillars are electrically connected to a first leadframe portion and a second leadframe portion of the semiconductor package where the first leadframe portion and the second leadframe portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second leadframe portions, the first and second leadframe portions forming terminals of the current sense resistor.

Abstract: A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a chip-scale semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer has an array of metal pillars extending therefrom. The metal pillars are to be electrically connected to a first conductive trace portion and a second conductive trace portion formed on a printed circuit board where the first conductive trace portion and the second conductive trace portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second metal trace portions, the first and second conductive trace portions forming terminals of the current sense resistor.

Abstract: A safety system controls the activation of one or more downhole tools by providing selective transmission of an activation signal or an energy stream. In a preferred embodiment, transmission of the activation signal or the energy stream is allowed after the tool has passed below a known pre-determined depth. A preferred safety system includes a first device in fixed relationship with the downhole tool and a second device fixed at the stationary location. The first device permits, after reaching the pre-determined depth, either (a) an initiation signal to reach an initiation device associated with a downhole tool upon or (b) the energy stream to reach a downhole tool. The second device positively engages the first device to provide an indication that the specified depth has been reached.

Abstract: A safety system controls the activation of one or more downhole tools by providing selective transmission of an activation signal or an energy stream. In a preferred embodiment, transmission of the activation signal or the energy stream is allowed after the tool has passed below a known pre-determined depth. A preferred safety system includes a first device in fixed relationship with the downhole tool and a second device fixed at the stationary location. The first device permits, after reaching the pre-determined depth, either (a) an initiation signal to reach an initiation device associated with a downhole tool upon or (b) the energy stream to reach a downhole tool. The second device positively engages the first device to provide an indication that the specified depth has been reached.

Abstract: A jarring tool uses a button member to control the jarring sequence used to free an object lodged in a well bore. A preferred tool includes an anvil having a sleeve portion adapted to enter a bore of a hammer. The button member allows selective entry of the anvil sleeve into the hammer bore. A preferred telemetry link includes two or more at least partially conductive members in a telescopic relationship for exchanging electrical signals with the object. The members extend and retract to accommodate length changes of the jarring tool. An exemplary jarring sequence includes a loading phase, a release phase, and a reset phase. In the loading phase, the button member prevents hammer movement toward the anvil. During the release phase, the button member allows the hammer to be propelled against the anvil. In the reset phase, the hammer and button returns to their initial positions.

Abstract: A jarring tool uses a button member to control the jarring sequence used to free an object lodged in a well bore. A preferred tool includes an anvil having a sleeve portion adapted to enter a bore of a hammer. The button member allows selective entry of the anvil sleeve into the hammer bore. A preferred telemetry link includes two or more at least partially conductive members in a telescopic relationship for exchanging electrical signals with the object. The members extend and retract to accommodate length changes of the jarring tool. An exemplary jarring sequence includes a loading phase, a release phase, and a reset phase. In the loading phase, the button member prevents hammer movement toward the anvil. During the release phase, the button member allows the hammer to be propelled against the anvil. In the reset phase, the hammer and button returns to their initial positions.