Patents by Inventor Cameron Nelson

Cameron Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with improved thermal dissipation and manufacturing methods
    Patent number: 11114400
    Abstract: A semiconductor device includes a semiconductor die, a redistribution structure, a interconnection structure, and a thermal path structure. The redistribution structure includes an insulation layer over a first surface of the semiconductor die and a conductive trace separated from the first surface by the insulation layer. The conductive trace extends laterally over the first surface from a first end toward a second end that is electrically coupled to a bond pad on the first surface of the semiconductor die. The interconnection structure is coupled to the first end of the conductive trace. The thermal path structure provides a thermal path between the semiconductor die and the interconnection structure. In some embodiment, the thermal path structure comprises a thermal pad that passes through the insulation layer. In other embodiments, the thermal path structure comprises a dummy pad on the first surface of the semiconductor die.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: September 7, 2021
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
    Inventor: Cameron Nelson
  • SEMICONDUCTOR DEVICE WITH IMPROVED THERMAL DISSIPATION AND MANUFACTURING METHODS
    Publication number: 20200083186
    Abstract: A semiconductor device includes a semiconductor die, a redistribution structure, a interconnection structure, and a thermal path structure. The redistribution structure includes an insulation layer over a first surface of the semiconductor die and a conductive trace separated from the first surface by the insulation layer. The conductive trace extends laterally over the first surface from a first end toward a second end that is electrically coupled to a bond pad on the first surface of the semiconductor die. The interconnection structure is coupled to the first end of the conductive trace. The thermal path structure provides a thermal path between the semiconductor die and the interconnection structure. In some embodiment, the thermal path structure comprises a thermal pad that passes through the insulation layer. In other embodiments, the thermal path structure comprises a dummy pad on the first surface of the semiconductor die.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 12, 2020
    Inventor: Cameron Nelson