Patents by Inventor Cameron Peter Jue

Cameron Peter Jue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
    Publication number: 20230408829
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
    Type: Application
    Filed: September 6, 2023
    Publication date: December 21, 2023
    Inventors: Michael Pope, Cameron Peter Jue, Rajat Mittal, Ryan Fleming, Boyd Drew Allin
  • Thermal management system for electronic device
    Patent number: 11782281
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 10, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Michael Pope, Cameron Peter Jue, Rajat Mittal, Ryan Fleming, Boyd Drew Allin
  • Thermal management system for electronic device
    Patent number: 11698536
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: July 11, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Michael Pope, Cameron Peter Jue, Balaji Chelladurai
  • THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
    Publication number: 20230030748
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Inventors: Michael Pope, Cameron Peter Jue, Rajat Mittal, Ryan Fleming, Boyd Drew Allin
  • THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
    Publication number: 20230035571
    Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Inventors: Michael Pope, Cameron Peter Jue, Balaji Chelladurai