Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Abstract: A sensor device having a first housing with a first semiconductor body and a plurality of metallic terminal contacts for electrical contacting of a first sensor, and a second housing with a second semiconductor body with a plurality of metallic terminal contacts for electrical contacting of a second sensor. A section of the plurality of terminal contacts penetrates the second housing on the face side and the second semiconductor body is arranged with a back surface on a front side of the second metal substrate. The two housings form a module, whereby the two housings are connected form-fittingly to one another in the shape of a stack by a fixing device in a way in which the bottom side of the first housing is joined to the bottom side of the second housing and the plurality of terminal contacts of the two housings point in the same direction.

Abstract: A sensor device having a first housing with a first semiconductor body and a plurality of metallic terminal contacts for electrical contacting of a first sensor, and a second housing with a second semiconductor body with a plurality of metallic terminal contacts for electrical contacting of a second sensor. A section of the plurality of terminal contacts penetrates the second housing on the face side and the second semiconductor body is arranged with a back surface on a front side of the second metal substrate. The two housings form a module, whereby the two housings are connected form-fittingly to one another in the shape of a stack by a fixing device in a way in which the bottom side of the first housing is joined to the bottom side of the second housing and the plurality of terminal contacts of the two housings point in the same direction.

Abstract: An arrangement of integrated circuit dice, includes first die including a first electrical coupling site and a second die comprising a second electrical coupling site, wherein the second die is stacked onto the first die such that the first electrical coupling site is at least partially exposed, wherein the first electrical coupling site and the second electrical coupling site are directly electrically connected, and a third die arranged above the first die and the second die such that a recess is formed, wherein one of the first electrical coupling sites is arranged in the recess.

Abstract: An arrangement of integrated circuit dice, includes first die including a first electrical coupling site and a second die comprising a second electrical coupling site, wherein the second die is stacked onto the first die such that the first electrical coupling site is at least partially exposed, wherein the first electrical coupling site and the second electrical coupling site are directly electrically connected, and a third die arranged above the first die and the second die such that a recess is formed, wherein one of the first electrical coupling sites is arranged in the recess.