Abstract: A system having an electrode probe and a temperature sensing device, wherein the temperature sensing device is positionable within the electrode probe. The probe can have an elongate electrode body, at least two electrode contacts disposed on the electrode body, and a lumen defined within the electrode body, and the temperature sensing device can have an elongate outer body having a lumen, an elongate inner sensing body disposed within the lumen, and at least one temperature sensor disposed on the elongate inner sensing body. The system in certain embodiments can also have a controller configured to receive temperature information from the temperature sensing device and use the temperature information to adjust energy supply to at least one of the at least two electrode contacts.

Abstract: Methods and devices for implanting spinal cord stimulation devices, including thin-film spinal cord stimulation devices. In some embodiments, the devices include an introduction needle and/or sheath, a stylet, and a pushing device for urging a stimulation device into the epidural space by controlling the proximal end of the device, including, in some cases, deformable thin-film spinal cord stimulation devices. Further implementations include a deployment device for ensuring deployment of the stimulation device in the epidural space. In other embodiments, the devices include sutures attached to a distal portion of the stimulation device, at least one introduction tube, a lead introduction device, and/or a suture introduction device for urging a stimulation device into the epidural space by controlling both the proximal and distal ends of the device, including, in some cases, deformable thin-film spinal cord stimulation devices.

Abstract: Various deformable thin film spinal cord stimulation devices that are deformable to conform to the shape and/or movement of the target spinal cord. Each device embodiment has an electrode body with at least one deformation section disposed longitudinally within the electrode body and at least one electrode contact. Some implementations have a distal structure that can be formed into a pusher receiving structure such as a pocket or a collar.

Abstract: Electrode devices are provided having certain thin film components, including at least one thin film contact and a temperature sensor associated with the contact. The temperature sensor can be used to monitor the temperature during use of the electrode device, including during electrical stimulation or ablation. Further, the temperature sensor can be used to identify the most effective temperature for stimulation or ablation.

Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.

Abstract: Various methods for making probe devices that include the addition of electrode contact material using various different processes and/or techniques, along with the resulting devices. Some methods include adding electrode contact material such that the resulting electrode contacts are suitable for direct contact with patient tissue while encapsulating materials that are not.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.

Abstract: Disclosed are biocompatible multi-electrode devices capable of being implanted in sensitive tissue, such as the brain, and methods for fabricating such arrays. The disclosed arrays can be implanted in living biological tissue with a single needle insertion. The devices can include linear arrays with contacts along an edge, linear arrays with multiple electrodes per opening in a parylene support layer, multi-thread electrode arrays, tree-like electrode arrays, and combinations thereof. In an embodiment, a compliant electrode apparatus can comprise a biocompatible and bio-implantable compliant dielectric having a top edge defined by a top and a side along a length of the dielectric, insulated electrical traces oriented along the length of the dielectric, and electrode contacts coupled to the traces and situated on the side along the length of the dielectric, wherein an exposed portion of a respective electrode contact protrudes beyond the top edge of the dielectric.