Patents by Inventor Can Deng

Can Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6153530
    Abstract: Disclosed herein is a post-etch treatment for plasma etched metal-comprising features in semiconductor devices. The post-etch treatment significantly reduces or eliminates surface corrosion of the etched metal-comprising feature. It is particularly important to prevent the formation of moisture on the surface of the feature surface prior to an affirmative treatment to remove corrosion-causing contaminants from the feature surface. Avoidance of moisture formation is assisted by use of a high vacuum; use of an inert, moisture-free purge gas; and by maintaining the substrate at a sufficiently high temperature to volatilize moisture.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: November 28, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Yan Ye, Xiaoye Zhao, Chang-Lin Hsieh, Xian-Can Deng, Wen-Chiang Tu, Chung-Fu Chu, Diana Xiaobing Ma
  • Patent number: 5866483
    Abstract: A method for etching a tungsten containing layer 25 on a substrate 10 substantially anisotropically, with good etching selectivity, and without forming excessive passivating deposits on the etched features. In the method, the substrate 10 is placed in a plasma zone 55, and process gas comprising SF.sub.6, CHF.sub.3, and N.sub.2, is introduced into the plasma zone. A plasma is formed from the process gas to anisotropically etch the tungsten containing layer 22. Preferably, the plasma is formed using combined inductive and capacitive plasma operated at a predefined inductive:capacitive power ratio.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: February 2, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Guang-Jye Shiau, Paul Herz, Xian-Can Deng, Xiaobing Diana Ma
  • Patent number: D897980
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: October 6, 2020
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Haoxia Wu, Mingfei Chen, Can Deng