Patents by Inventor Can E. KORMAN

Can E. KORMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible IC/microfluidic integration and packaging
    Patent number: 9116145
    Abstract: A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: August 25, 2015
    Assignee: The George Washington University
    Inventors: Zhenyu Li, Mona E. Zaghloul, Bowei Zhang, Can E. Korman
  • Flexible IC/microfluidic integration and packaging
    Publication number: 20130243655
    Abstract: A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).
    Type: Application
    Filed: December 14, 2012
    Publication date: September 19, 2013
    Applicant: The George Washington University
    Inventors: Zhenyu LI, Mona E. ZAGHLOUL, Bowei ZHANG, Can E. KORMAN