Patents by Inventor Can Hua Chen

Can Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140322432
    Abstract: An assembly method of a voice coil motor for assembling component parts of a voice coil motor includes the following steps: (1) providing identifiable glue, and the identifiable glue is made by mixing colorable substance or phosphor into transparent glue; (2) coating the identifiable glue on connecting positions of the component parts; (3) curing the identifiable glue, and identifying the identifiable glue simultaneously to check dispensing and curing effect of the component parts. The assembly method can cure and check the voice coil motor simultaneously, thereby it can improve the production efficiency, reduce the manpower, and promote the development of the automated production line. An assembly device is also disclosed.
    Type: Application
    Filed: June 12, 2013
    Publication date: October 30, 2014
    Inventors: Chun Bai LI, Can Hua Chen, Yiu Sing Ho, Murata Shuji
  • Patent number: 7600310
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: October 13, 2009
    Assignee: SAE Magnetics (H.K.) Lts.
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery L. Wang, Can Hua Chen
  • Patent number: 7522384
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: April 21, 2009
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery L. Wang, Can Hua Chen
  • Patent number: 7401725
    Abstract: A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more actuator coil leads, such as by solder bump bonding, and the flexible cable/actuator coil coupling is embedded in an actuator frame, such as by polymer injection molding.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: July 22, 2008
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Yiu Sing Ho, Guo Hong Lu, Can Hua Chen, Yuan Neng Luo, Jeffrey L. Wang, Liu Jun Zhang
  • Patent number: 7245458
    Abstract: A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: July 17, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Liu Jun Zhang, Guo Hong Lu, Can Hua Chen, Yiu Sing Ho, Jeffery L. Wang
  • Publication number: 20060232890
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Application
    Filed: June 16, 2006
    Publication date: October 19, 2006
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery Wang, Can Hua Chen
  • Publication number: 20060168796
    Abstract: A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).
    Type: Application
    Filed: April 4, 2006
    Publication date: August 3, 2006
    Inventors: Liu Jun Zhang, Guo Hong Lu, Can Hua Chen, Yiu Sing Ho, Jeffery Wang
  • Publication number: 20050013055
    Abstract: A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
    Type: Application
    Filed: January 7, 2004
    Publication date: January 20, 2005
    Inventors: Yiu Sing Ho, Hiroshi Fukaya, Kam Fung Yip, Satoshi Yamaguchi, Jeffery Wang, Can Hua Chen
  • Publication number: 20040200889
    Abstract: A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more actuator coil leads, such as by solder bump bonding, and the flexible cable/actuator coil coupling is embedded in an actuator frame, such as by polymer injection molding.
    Type: Application
    Filed: December 19, 2003
    Publication date: October 14, 2004
    Inventors: Yiu Sing Ho, Guo Hong Lu, Can Hua Chen, Yuan Neng Luo, Jeffery L. Wang, Liu Jun Zhang