Patents by Inventor Candy Ching-Fai Siu

Candy Ching-Fai Siu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro grooved support surface for reducing substrate wear and slip formation
    Patent number: 6264467
    Abstract: A novel apparatus and method of making the apparatus for supporting a substrate during processing. A base defining grooves at a substrate support location is described. Grooves are provided to catch wear particles from the substrate caused by friction during relative movement between the substrate and the support. A plurality of substrate support locations can be provided on the base surface. The base surface preferably comprises an annulus with substrate support locations spaced circumferentially around the annulus. Protrusions may be provided at substrate support locations. The protrusions define contact surfaces on which grooves can be formed.
    Type: Grant
    Filed: April 14, 1999
    Date of Patent: July 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Brian Lue, Andreas G. Hegedus, Dean Jennings, Candy Ching-Fai Siu