Patents by Inventor Candy Liang

Candy Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
    Patent number: 7338909
    Abstract: A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and, applying a wet etchant to cover a targeted etching portion of the process surface while excluding an adjacent surrounding area to selectively etch the material layer overlying the targeted etching portion.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: March 4, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Yu-Liang Lin, Henry Lo, Chung-Long Chang, Gorge Huang, Tony Lu, Gnesh Yeh, Candy Liang, Chun-Hsien Lin, Mei Sheng Zhou, Sunny Su, Ai-Sen Liu, Cheng-Lin Huang, Li-Jui Chen, Shih Che Wang
  • Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
    Publication number: 20050282396
    Abstract: A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and, applying a wet etchant to cover a targeted etching portion of the process surface while excluding an adjacent surrounding area to selectively etch the material layer overlying the targeted etching portion.
    Type: Application
    Filed: June 18, 2004
    Publication date: December 22, 2005
    Inventors: Yu-Liang Lin, Henry Lo, Chung-Long Chang, Gorge Huang, Tony Lu, Gnesh Yeh, Candy Liang, Chun-Hsien Lin, Mei Sheng Zhou, Sunny Wu, Ai-Sen Liu, Cheng-Lin Huang, Li-Jui Chen, Shih Wang