Abstract: Provided are a heat collecting pump and a washing appliance. The heat collecting pump includes: a housing defining an accommodation cavity and having a fluid inlet, a fluid outlet, and a mounting opening; a heating device and a flow guiding element that are disposed in the accommodation cavity; a drive device connected to the housing and configured to drive a fluid to flow from the fluid inlet to the fluid outlet. The flow guiding element has an inner wall defining a fluid inlet channel in communication with the fluid inlet. A fluid discharge channel is defined between an outer wall of the flow guiding element and an inner wall of the accommodation cavity, and is in communication with the fluid inlet channel and the fluid outlet, respectively. The flow guiding element has a flow guiding portion configured to guide a fluid in the fluid discharge channel towards the fluid outlet.

Abstract: According to an embodiment of a semiconductor device, the device includes a semiconductor substrate having a transistor region and a diode region. The transistor region includes a plurality of IGBT cells, and a charge carrier compensation region configured to expel or admit drift zone minority charge carriers based on an on-state or an off-state of the IGBT cells. The diode region includes a plurality of diode cells. An isolation structure is provided between the transistor region and the diode region. The isolation structure includes a first trench extending lengthwise along at least part of a periphery of the diode region and a second trench interposed between the first trench and the transistor region. The charge carrier compensation region extends to the second trench of the isolation structure but not the first trench such that the charge carrier compensation region is electrically isolated from an anode potential of the diode region.

Abstract: There are disclosed herein various implementations of a bipolar semiconductor device with multi-trench enhancement regions. Such a bipolar semiconductor device includes a drift region having a first conductivity type situated over an anode layer having an opposite, second conductivity type. The device also includes a first control trench extending through an inversion region having the second conductivity type, and further extending into the drift region, the first control trench being adjacent to cathode diffusions. In addition, the device includes first and second depletion trenches, each having a depletion electrode, the first depletion trench being situated between the second depletion trench and the first control trench. An enhancement region having the first conductivity type is localized in the drift region and extends from the first control trench to the first second depletion trench and further from the first depletion trench to the second depletion trench.

Abstract: There are disclosed herein various implementations of a bipolar semiconductor device with sub-cathode enhancement regions. Such a bipolar semiconductor device includes a drift region having a first conductivity type situated over an anode layer having a second conductivity type opposite the first conductivity type. The bipolar semiconductor device also includes first and second depletion trenches, each having a depletion electrode. In addition, the bipolar semiconductor device includes a first control trench situated between the first and second depletion trenches, the first control trench extending into the drift region and being adjacent to cathode diffusions. An enhancement region having the first conductivity type is localized in the drift region between the first control trench and one or both of the first and second depletion trenches. In one implementation, the bipolar semiconductor device may be an insulated-gate bipolar transistor (IGBT).

Abstract: There are disclosed herein various implementations of a bipolar semiconductor device having localized enhancement regions. Such a bipolar semiconductor device includes a drift region having a first conductivity type situated over an anode layer having a second conductivity type opposite the first conductivity type. The bipolar semiconductor device also includes a first control trench extending through an inversion region having the second conductivity type, and further extending into the drift region, the first control trench being adjacent to cathode diffusions. In addition, the bipolar semiconductor device includes first and second depletion trenches, each having a depletion electrode, the first depletion trench being situated between the second depletion trench and the first control trench. An enhancement region having the first conductivity type is localized in the drift region between the first and second depletion trenches.

Abstract: There are disclosed herein various implementations of a bipolar semiconductor device with multi-trench enhancement regions. Such a bipolar semiconductor device includes a drift region having a first conductivity type situated over an anode layer having an opposite, second conductivity type. The device also includes a first control trench extending through an inversion region having the second conductivity type, and further extending into the drift region, the first control trench being adjacent to cathode diffusions. In addition, the device includes first and second depletion trenches, each having a depletion electrode, the first depletion trench being situated between the second depletion trench and the first control trench. An enhancement region having the first conductivity type is localized in the drift region and extends from the first control trench to the first second depletion trench and further from the first depletion trench to the second depletion trench.

Abstract: There are disclosed herein various implementations of a bipolar semiconductor device with sub-cathode enhancement regions. Such a bipolar semiconductor device includes a drift region having a first conductivity type situated over an anode layer having a second conductivity type opposite the first conductivity type. The bipolar semiconductor device also includes first and second depletion trenches, each having a depletion electrode. In addition, the bipolar semiconductor device includes a first control trench situated between the first and second depletion trenches, the first control trench extending into the drift region and being adjacent to cathode diffusions. An enhancement region having the first conductivity type is localized in the drift region between the first control trench and one or both of the first and second depletion trenches. In one implementation, the bipolar semiconductor device may be an insulated-gate bipolar transistor (IGBT).

Abstract: In one embodiment, contextual information pertaining to a user's context may be ascertained. A request for suggested search queries pertaining to the user's context may be received via a device. One or more key words that are pertinent to the context may be ascertained. One or more suggested search queries may be provided based, at least in part, upon the one or more key words, wherein the one or more suggested search queries are provided for presentation via the device prior to receiving input from the user via a search box of the device.

Abstract: A method of selectively growing silicon carbide is provided. The method includes forming a mask including tantalum carbide that masks a portion of a substrate, and epitaxially growing a crystal including silicon carbide seeded by an exposed surface of the substrate. A method of selectively etching silicon carbide is also provided. The method includes forming a mask including tantalum carbide that masks a portion of a substrate, and etching an exposed surface of the substrate. A method of fabricating a device is further provided that includes forming a mask including tantalum carbide that masks a portion of a first layer of the device, and epitaxially growing a second layer of the device, wherein the second layer includes a crystal including silicon carbide seeded by an exposed surface of the first layer.