Patents by Inventor Cao M. Thai

Cao M. Thai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentration
    Patent number: 5589129
    Abstract: A liquid resin composition prepared by mixing an ionic material and/or a chargeable material into a thermosetting or thermoplastic resin is injected into a mold having a predetermined inner shape, and a DC voltage is applied to the liquid resin composition to concentrate the ionic material and/or chargeable material on a desired portion or to distribute the ionic material and/or chargeable material continuously. Thereafter, the resin composition is thermally cured when the resin composition contains the thermosetting resin, or the resin composition is hardened by cooling when the resin composition contains the thermoplastic resin, thereby obtaining a molding having a predetermined shape.
    Type: Grant
    Filed: June 19, 1995
    Date of Patent: December 31, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsuguo Kato, Cao M. Thai
  • Resin-encapsulated semiconductor device
    Patent number: 5536970
    Abstract: A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically connected with a bonding pad portion of the semiconductor chip, and an encapsulating resin layer which encapsulates the semiconductor chip so that a part of the lead is guided to the outside, wherein an adhesive resin layer is interposed at least either between the die pad and the die bonding portion is described, or between the semiconductor chip and the die bonding portion.
    Type: Grant
    Filed: October 27, 1994
    Date of Patent: July 16, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Michiya Higashi, Cao M. Thai
  • Epoxy resin composition
    Patent number: 4829134
    Abstract: An epoxy resin composition containing an oxazoline compound in an epoxy resin.
    Type: Grant
    Filed: August 11, 1987
    Date of Patent: May 9, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsuguo Sakamoto, Kazuhiko Kurematsu, Yukihiro Mikogami, Shuichi Suzuki, Cao M. Thai
  • Epoxy resin composition for cast molding
    Patent number: 4617330
    Abstract: An epoxy resin composition for cast molding which comprises:(A) an epoxy resin;(B) a curing agent;(C) cut fibers having distributions of 3 to 20 .mu.m in diameter and 3 to 1500 .mu.m in length;(D) inorganic powder having a size distribution of particles with 90% by weight or more of particles with particle sizes of 10 .mu.m or less and 50% by weight or more of particles with particle sizes of 5 .mu.m or less,the total amount of the components (C) and (D) formulated being 40 to 225 parts by volume per 100 parts by volume of the total amount of the components (A) and (B) formulated displays excellent crack resistance, strength as well as a low shrinkage characteristic and, good fluidity.
    Type: Grant
    Filed: March 28, 1985
    Date of Patent: October 14, 1986
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Cao M. Thai, Takayuki Oguni, Kazuhiko Kurematsu, Tsuguo Kato