Patents by Inventor Cao Ngoc Lam

Cao Ngoc Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS probe fabrication on a reusable substrate for probe card application
    Patent number: 8089294
    Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: January 3, 2012
    Assignee: WinMENS Technologies Co., Ltd.
    Inventors: Tseng-Yang Hsu, Cao Ngoc Lam
  • MEMS PROBE FABRICATION ON A REUSABLE SUBSTRATE FOR PROBE CARD APPLICATION
    Publication number: 20100033201
    Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 11, 2010
    Inventors: Tseng-Yang Hsu, Cao Ngoc Lam