Patents by Inventor Capp. Michael L.

Capp. Michael L. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-conductive metal ceramic composite material panel system for improved heat dissipation
    Patent number: 5113315
    Abstract: For use as a substrate for a heat generating microelectronic integrated circuit, a ceramic panel is provided having small thickness in comparison to its length and breadth, having on at least the surface opposite the one bearing the microelectronic integrated circuit, a layer of heat conductive metal and having a plurality of closely spaced, small cross section extensions of the heat conductive metal layer extending into the ceramic material to a depth of at least about one fifth of its thickness. The substrate is particularly useful for the mounting of hybrid microelectronic circuits to improve the heat dissipation capability of the ceramic substrate.
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: May 12, 1992
    Assignee: Cirqon Technologies Corporation
    Inventors: Capp. Michael L., Arthur O. Capp, Jr.