Patents by Inventor Carey Blue

Carey Blue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldered integrated circuit connections
    Patent number: 6391468
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 21, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Soldered integrated circuit connections
    Publication number: 20010011676
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Application
    Filed: March 30, 2001
    Publication date: August 9, 2001
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Soldered integrated circuit connections
    Patent number: 6248452
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: June 19, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Method for depositing solder paste on a pad
    Patent number: 6094832
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: August 1, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Soldered integrated circuit connections
    Patent number: 6012231
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: January 11, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue