Patents by Inventor Carin Lundquist Ruiz

Carin Lundquist Ruiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11251103
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Jerrod Peterson, Carin Lundquist Ruiz, Akhilesh P. Rallabandi
  • Publication number: 20190252286
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.
    Type: Application
    Filed: March 29, 2019
    Publication date: August 15, 2019
    Applicant: INTEL CORPORATION
    Inventors: Jerrod Peterson, Carin Lundquist Ruiz, Akhilesh P. Rallabandi