Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

Abstract: One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate.

Abstract: A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus on the surface of the vertically oriented substrate, and moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate.

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

Abstract: A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.

Abstract: An apparatus (10, 50) for moving an elongate member (102) (such as a wireline (102)) which passes through a throughbore (70, 97) of a valve device such as a wireline valve used in the hydrocarbon production industry is provided. The apparatus includes an upper movement mechanism (18, 58; 91A, 91B; 116) and a lower movement mechanism (20, 60; 91A, 91B; 112) spaced apart about a portion of the valve device (70, 97). The upper (18, 58; 91A, 91B; 116) and lower (20, 60; 91A, 91B; 112) movement mechanisms are actuable such that they are capable of moving the elongate member (102) into a pre-determined position (70, 97), which is typically co-incident with the longitudinal axis of the valve device.

Abstract: An apparatus (10, 50) for moving an elongate member (102) (such as a wireline (102)) which passes through a throughbore (70, 97) of a valve device such as a wireline valve used in the hydrocarbon production industry is provided. The apparatus includes an upper movement mechanism (18, 58; 91A, 91B; 116) and a lower movement mechanism (20, 60; 91A, 91B; 112) spaced apart about a portion of the valve device (70, 97). The upper (18, 58; 91A, 91B; 116) and lower (20, 60; 91A, 91B; 112) movement mechanisms are actuable such that they are capable of moving the elongate member (102) into a pre-determined position (70, 97), which is typically co-incident with the longitudinal axis of the valve device.

Abstract: A collapsible stage (1) is provided which has a first planar wing (3), a second planar wing (5) and an intermediate planar section (7). The respective wings (3 to 5) are hinged to respective sides of the intermediate section (7) so they can both swing upwardly from a plane where they are co-planar with the intermediate section where they collectively form an open stage (1), to a collapsed position where both wings (3 to 5) are generally parallel to one another and extend upright. The intermediate section (7) has ground engaging devices (17) to permit rolling or sliding movement of the collapsed stage. A first pair of retractable legs (11) are connected with an underside of the first wing (3) adjacent one side of the intermediate section (7), and a second pair of retractable legs (13) are connected with an underside of the second wing (5) and the other side of the intermediate section (7).